PIC16LF724-E/PT Microchip Technology, PIC16LF724-E/PT Datasheet - Page 220
![7 KB Flash, 16 MHz Int. Osc, NanoWatt XLP 44 TQFP 10x10x1mm TRAY](/photos/6/82/68251/c04-076_pt_sml.jpg)
PIC16LF724-E/PT
Manufacturer Part Number
PIC16LF724-E/PT
Description
7 KB Flash, 16 MHz Int. Osc, NanoWatt XLP 44 TQFP 10x10x1mm TRAY
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr
Datasheet
1.AC164112.pdf
(302 pages)
Specifications of PIC16LF724-E/PT
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
36
Program Memory Size
7KB (4K x 14)
Program Memory Type
FLASH
Ram Size
192 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 14x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
44-TQFP, 44-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16LF724-E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
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PIC16F72X/PIC16LF72X
23.5
DS41341E-page 220
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Note 1: I
Param
No.
2: T
3: T
Thermal Considerations
P
DD
INTERNAL
A
J
T
Sym.
P
P
= Junction Temperature
θ
θ
JMAX
= Ambient Temperature
PD
DER
is current to run the chip alone without driving any load on the output pins.
JA
JC
I
/
O
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Case
Maximum Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
A
Characteristic
≤ +125°C
Typ.
27.5
27.5
47.2
24.4
31.4
24.7
14.5
150
60
80
90
46
24
24
24
24
20
—
—
—
—
Units
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C
W
W
W
W
28-pin SPDIP package
28-pin SOIC package
28-pin SSOP package
28-pin UQFN 4x4mm package
28-pin QFN 6x6mm package
40-pin PDIP package
44-pin TQFP package
44-pin QFN 8x8mm package
28-pin SPDIP package
28-pin SOIC package
28-pin SSOP package
28-pin UQFN 4x4mm package
28-pin QFN 6x6mm package
40-pin PDIP package
44-pin TQFP package
44-pin QFN 8x8mm package
PD = P
P
P
P
INTERNAL
I
DER
/
O
= Σ (I
= PD
INTERNAL
© 2009 Microchip Technology Inc.
OL
= I
MAX
* V
DD
Conditions
(T
OL
+ P
x V
J
) + Σ (I
- T
DD
I
/
O
A
(1)
)/θ
OH
JA
(2)
* (V
DD
- V
OH
))
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