PIC18F23K20-E/ML Microchip Technology, PIC18F23K20-E/ML Datasheet - Page 9

• Manufacturer Part Number: PIC18F23K20-E/ML
• Description: 8 KB Enh Flash, 768 RAM, 25 I/O Pb Free, Nanowatt XLP 28 QFN 6x6mm TUBE
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 18Fr

Specifications of PIC18F23K20-E/ML

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 24
• Program Memory Size: 8KB (4K x 16)
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 11x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 I/O Ports .................................................................................................................................................................................. 121
11.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................ 143
12.0 Timer0 Module ........................................................................................................................................................................ 155
13.0 Timer1 Module ........................................................................................................................................................................ 159
14.0 Timer2 Module ........................................................................................................................................................................ 167
15.0 Timer3 Module ........................................................................................................................................................................ 169
16.0 Enhanced Capture/Compare/PWM (ECCP) Module............................................................................................................... 173
17.0 Master Synchronous Serial Port (MSSP) Module ................................................................................................................... 193
18.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) .............................................................. 237
19.0 Analog-to-Digital Converter (ADC) Module ............................................................................................................................. 265
20.0 Comparator Module................................................................................................................................................................. 279
21.0 Voltage References................................................................................................................................................................. 289
22.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................ 293
23.0 Special Features of the CPU................................................................................................................................................... 299
24.0 Instruction Set Summary ......................................................................................................................................................... 315
25.0 Development Support.............................................................................................................................................................. 365
26.0 Electrical Characteristics ......................................................................................................................................................... 369
27.0 DC and AC Characteristics Graphs and Tables...................................................................................................................... 403
28.0 Packaging Information............................................................................................................................................................. 427
Appendix A: Revision History............................................................................................................................................................ 441
Appendix B: Device Differences ....................................................................................................................................................... 442
Index ................................................................................................................................................................................................. 443
The Microchip Web Site .................................................................................................................................................................... 453
Customer Change Notification Service ............................................................................................................................................. 453
Customer Support ............................................................................................................................................................................. 453
Reader Response ............................................................................................................................................................................. 454
Product Identification System ........................................................................................................................................................... 455
 2010 Microchip Technology Inc.
Device Overview ....................................................................................................................................................................... 11
Oscillator Module (With Fail-Safe Clock Monitor)...................................................................................................................... 27
Power-Managed Modes ............................................................................................................................................................ 43
Reset ......................................................................................................................................................................................... 51
Memory Organization ................................................................................................................................................................ 65
Flash Program Memory............................................................................................................................................................. 89
Data EEPROM Memory ............................................................................................................................................................ 99
8 x 8 Hardware Multiplier......................................................................................................................................................... 105
Interrupts ................................................................................................................................................................................. 107
PIC18F2XK20/4XK20
DS41303G-page 9