PIC24FV16KA301-E/P Microchip Technology, PIC24FV16KA301-E/P Datasheet - Page 265
![16KB Flash, 2KB RAM, 512B EEPROM, 16 MIPS, 12-bit ADC, CTMU, 5V 20 PDIP .300in T](/photos/16/12/161290/pdip20_sml.jpg)
PIC24FV16KA301-E/P
Manufacturer Part Number
PIC24FV16KA301-E/P
Description
16KB Flash, 2KB RAM, 512B EEPROM, 16 MIPS, 12-bit ADC, CTMU, 5V 20 PDIP .300in T
Manufacturer
Microchip Technology
Series
PIC® XLP™ 24Fr
Datasheet
1.PIC24F16KA301T-ISO.pdf
(320 pages)
Specifications of PIC24FV16KA301-E/P
Processor Series
PIC24FV
Core
PIC
Data Bus Width
16 bit
Program Memory Type
Flash
Program Memory Size
16 KB
Data Ram Size
2 KB
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
Package / Case
PDIP-20
Development Tools By Supplier
MPLAB IDE Software
Minimum Operating Temperature
- 40 C
Core Processor
PIC
Core Size
16-Bit
Speed
32MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
17
Eeprom Size
512 x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Lead Free Status / Rohs Status
Details
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TABLE 29-1:
TABLE 29-2:
TABLE 29-3:
2011 Microchip Technology Inc.
Operating Junction Temperature Range
Operating Ambient Temperature Range
Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 20-Pin SPDIP
Package Thermal Resistance, 28-Pin SPDIP
Package Thermal Resistance, 20-Pin SSOP
Package Thermal Resistance, 28-Pin SSOP
Package Thermal Resistance, 20-Pin SOIC
Package Thermal Resistance, 28-Pin SOIC
Package Thermal Resistance, 20-Pin QFN
Package Thermal Resistance, 28-Pin QFN
Package Thermal Resistance, 44-Pin QFN
Package Thermal Resistance, 48-Pin UQFN
Note 1:
DC CHARACTERISTICS
DC10
DC12
DC16
DC17
Note 1:
m No.
Para
Internal Chip Power Dissipation:
I/O Pin Power Dissipation:
2:
P
P
V
V
V
SV
Symbol
INT
I
DD
DR
POR
/
O
Junction to ambient thermal resistance, Theta-
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
This is the limit to which V
DD
= ({V
= V
DD
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DC CHARACTERISTICS: TEMPERATURE AND VOLTAGE SPECIFICATIONS
Supply Voltage
RAM Data Retention
Voltage
V
to Ensure Internal
Power-on Reset Signal
V
to Ensure Internal
Power-on Reset Signal
x (I
DD
DD
DD
DD
– V
Start Voltage
Rise Rate
Characteristic
Characteristic
OH
– I
(2)
} x I
Rating
OH
OH
)
) + (V
DD
can be lowered without losing RAM data.
OL
Standard Operating Conditions: 1.8V to 3.6V PIC24F32KA3XX
Operating temperature
x I
0.05
Min
V
1.8
2.0
1.5
OL
SS
PIC24FV32KA304 FAMILY
)
Typ
—
—
—
—
—
JA
(1)
(
JA
Max Units
5.5V
) numbers are achieved by package simulations.
3.6
0.7
—
—
Symbol
Symbol
P
V/ms 0-3.3V in 0.1s
DMAX
P
T
T
-40°C T
JA
JA
JA
JA
JA
JA
JA
JA
JA
JA
V
V
V
V
A
D
J
For F devices
For FV devices
0-2.5V in 60 ms
62.4
80.2
Min
Typ
108
-40
-40
2.0V to 5.5V PIC24FV32KA3XX
60
71
75
43
32
29
—
A
+85°C for Industrial
(T
P
J
INT
– T
Max
Typ
Conditions
—
—
—
—
—
—
—
—
—
—
—
—
+ P
A
)/
I
/
O
JA
DS39995B-page 265
+125
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Max
Unit
+85
Notes
Unit
°C
°C
W
W
1
1
1
1
1
1
1
1
1
1
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