PIC24HJ128GP202-E/MM Microchip Technology, PIC24HJ128GP202-E/MM Datasheet - Page 348

• Manufacturer Part Number: PIC24HJ128GP202-E/MM
• Description: 16-bit MCU, 128KB Flash,DMA,40 MIPS,nanoWatt 28 QFN-S 6x6mm TUBE
• Manufacturer: Microchip Technology
• Series: PIC® 24Hr

Specifications of PIC24HJ128GP202-E/MM

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: I²C, IrDA, LIN, PMP, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 21
• Program Memory Size: 128KB (43K x 24)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 28-QFN
• Processor Series: PIC24HJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, SPI, UART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 21
• Number Of Timers: 9
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM300027
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 10 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

PIC24HJ32GP302/304, PIC24HJ64GPX02/X04 AND PIC24HJ128GPX02/X04
DS70293E-page 348
44-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
c
NOTE 1
e
b
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
β
N
1 2 3
D
D1
Dimension Limits
φ
E1
Units
L
A2
A1
E1
D1
L1
N
A
E
D
e
L
φ
b
α
β
NOTE 2
c
E
A1
A
0.95
0.05
0.45
0.09
0.30
MIN
11°
11°
0°
–
MILLIMETERS
L1
12.00 BSC
12.00 BSC
10.00 BSC
10.00 BSC
0.80 BSC
1.00 REF
NOM
1.00
0.60
0.37
3.5°
12°
12°
44
–
–
–
Microchip Technology Drawing C04-076B
© 2011 Microchip Technology Inc.
α
MAX
1.20
1.05
0.15
0.75
0.20
0.45
13°
13°
7°
A2