PIC24HJ16GP304-E/ML Microchip Technology, PIC24HJ16GP304-E/ML Datasheet - Page 192
![16-bit MCU, 16KB Flash,40 MIPS,nanoWatt 44 QFN 8x8x0.9mm TUBE](/photos/6/81/68122/150-44-qfn_sml.jpg)
PIC24HJ16GP304-E/ML
Manufacturer Part Number
PIC24HJ16GP304-E/ML
Description
16-bit MCU, 16KB Flash,40 MIPS,nanoWatt 44 QFN 8x8x0.9mm TUBE
Manufacturer
Microchip Technology
Series
PIC® 24Hr
Datasheets
1.PIC24HJ12GP201-ISO.pdf
(84 pages)
2.PIC24HJ32GP202-ISO.pdf
(272 pages)
3.PIC24HJ32GP202-ISO.pdf
(8 pages)
4.PIC24HJ32GP202-ISO.pdf
(12 pages)
Specifications of PIC24HJ16GP304-E/ML
Core Processor
PIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
35
Program Memory Size
16KB (5.5K x 24)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 13x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
44-QFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC24HJ16GP304-E/ML
Manufacturer:
MICROCHIP
Quantity:
12 000
- PIC24HJ12GP201-ISO PDF datasheet
- PIC24HJ32GP202-ISO PDF datasheet #2
- PIC24HJ32GP202-ISO PDF datasheet #3
- PIC24HJ32GP202-ISO PDF datasheet #4
- Current page: 192 of 272
- Download datasheet (4Mb)
PIC24HJ32GP202/204 AND PIC24HJ16GP304
22.1
TABLE 22-1:
TABLE 22-2:
TABLE 22-3:
DS70289G-page 192
Industrial Temperature Devices
Extended Temperature Devices
Power Dissipation:
Internal chip power dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 44-pin QFN
Package Thermal Resistance, 44-pin TFQP
Package Thermal Resistance, 28-pin SPDIP
Package Thermal Resistance, 28-pin SOIC
Package Thermal Resistance, 28-pin SSOP
Package Thermal Resistance, 28-pin QFN-S
Note 1:
Characteristic
Operating Junction Temperature Range
Operating Junction Temperature Range
DC Characteristics
P
I/O = Σ ({V
Operating Ambient Temperature Range
Operating Ambient Temperature Range
INT
Junction to ambient thermal resistance, Theta-
= V
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DD
x (I
- V
V
DD
(in Volts)
DD
3.0-3.6V
3.0-3.6V
OH
Characteristic
- Σ I
Range
} x I
Rating
OH
OH
)
) + Σ (V
OL
x I
OL
)
-40°C to +125°C
-40°C to +85°C
Temp Range
(in °C)
JA
(
θ
JA
) numbers are achieved by package simulations.
Symbol
Symbol
P
DMAX
θ
θ
θ
θ
θ
θ
P
T
T
T
T
JA
JA
JA
JA
JA
JA
A
A
D
J
J
Min
Typ
-40
-40
-40
-40
32
45
45
50
71
35
PIC24HJ32GP202/204 and
(T
© 2011 Microchip Technology Inc.
PIC24HJ16GP304
P
INT
J
- T
Max
Typ
Max MIPS
—
—
—
—
—
—
—
—
—
—
+ P
A
)/θ
40
40
I
/
JA
O
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
+125
+155
+125
Max
Unit
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
1
1
1
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