PIC24HJ256GP210T-I/PF Microchip Technology, PIC24HJ256GP210T-I/PF Datasheet - Page 274

16 Bit MCU 40MIPS 256KB FLASH 100 TQFP 14x14x1mm T/R

PIC24HJ256GP210T-I/PF

Manufacturer Part Number
PIC24HJ256GP210T-I/PF
Description
16 Bit MCU 40MIPS 256KB FLASH 100 TQFP 14x14x1mm T/R
Manufacturer
Microchip Technology
Series
PIC® 24Hr

Specifications of PIC24HJ256GP210T-I/PF

Core Processor
PIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
85
Program Memory Size
256KB (85.5K x 24)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 32x10b, 32x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM300024 - KIT DEMO DSPICDEM 1.1MA240012 - MODULE PLUG-IN PIC24H 100QFPDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164323 - MODULE SKT FOR 100TQFP
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC24HJ256GP210T-I/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
PIC24HJXXXGPX06/X08/X10
DS70175H-page 272
100-Lead Plastic Thin Quad Flatpack (PT) – 12x12x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
c
e
b
β
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
N
1 23
D
D1
Dimension Limits
E1
φ
L
NOTE 2
Units
A2
A1
E1
D1
L1
N
D
e
A
L
E
b
α
β
φ
c
E
A
A1
MIN
0.95
0.05
0.45
0.09
0.13
11°
11°
L1
MILLIMETERS
14.00 BSC
14.00 BSC
12.00 BSC
12.00 BSC
0.40 BSC
1.00 REF
NOM
1.00
0.60
0.18
3.5°
100
12°
12°
Microchip Technology Drawing C04-100B
© 2009 Microchip Technology Inc.
MAX
1.20
1.05
0.15
0.75
0.20
0.23
13°
13°
A2
α

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