PIC32MX695F512LT-80I/PF Microchip Technology, PIC32MX695F512LT-80I/PF Datasheet - Page 201
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PIC32MX695F512LT-80I/PF
Manufacturer Part Number
PIC32MX695F512LT-80I/PF
Description
512KB Flash, 128KB RAM, 80 MHz, USB, ENET, 8 DMA 100 TQFP 14x14x1mm T/R
Manufacturer
Microchip Technology
Series
PIC® 32MXr
Datasheets
1.PIC32MX320F032H-40IPT.pdf
(66 pages)
2.PIC32MX575F256H-80IMR.pdf
(2 pages)
3.PIC32MX575F256H-80IMR.pdf
(254 pages)
4.PIC32MX575F256H-80IMR.pdf
(14 pages)
Specifications of PIC32MX695F512LT-80I/PF
Core Processor
MIPS32® M4K™
Core Size
32-Bit
Speed
80MHz
Connectivity
Ethernet, I²C, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
85
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
2.3 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP
Processor Series
PIC32MX6xx
Core
MIPS
3rd Party Development Tools
52713-733, 52714-737
Development Tools By Supplier
PG164130, DV164035, DV244005
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC32MX695F512LT-80I/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
- PIC32MX320F032H-40IPT PDF datasheet
- PIC32MX575F256H-80IMR PDF datasheet #2
- PIC32MX575F256H-80IMR PDF datasheet #3
- PIC32MX575F256H-80IMR PDF datasheet #4
- Current page: 201 of 254
- Download datasheet (6Mb)
FIGURE 31-11:
TABLE 31-29: SPIx MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS
© 2010 Microchip Technology Inc.
AC CHARACTERISTICS
SP10
SP11
SP20
SP21
SP30
SP31
SP35
SP36
SP40
SP41
Note 1:
Param.
No.
Note: Refer to
(CKP = 0)
(CKP = 1)
SDI
SCK
SDO
SCK
2:
3:
4:
X
X
X
X
T
T
T
T
T
T
T
T
T
T
T
T
T
T
SC
SC
SC
SC
SC
SC
SC
SC
DO
DO
DO
DO
DI
DI
Symbol
These parameters are characterized, but not tested in manufacturing.
Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
The minimum clock period for SCKx is 40 ns. Therefore, the clock generated in Master mode must not
violate this specification.
Assumes 50 pF load on all SPIx pins.
V2
V2
L
H
F
R
H2
L2
H2
L2
F
R
V2
V2
SC
SC
DO
DI
DO
DI
SC
SC
Figure 31-1
L
L,
H,
L
V
V,
,
L
SP40
SP36
SCKx Output Low Time (Note 3)
SCKx Output High Time (Note 3)
SCKx Output Fall Time (Note 4)
SCKx Output Rise Time (Note 4)
SDOx Data Output Fall Time
(Note 4)
SDOx Data Output Rise Time
(Note 4)
SDOx Data Output Valid after
SCKx Edge
SDOx Data Output Setup to
First SCKx Edge
Setup Time of SDIx Data Input to
SCKx Edge
Hold Time of SDIx Data Input
to SCKx Edge
SPIx MODULE MASTER MODE (CKE = 1) TIMING CHARACTERISTICS
MSb In
for load conditions.
MSb
Characteristics
SP41
SP11
SP30,SP31
SP35
SP10
(1)
Bit 14 - - - - - -1
Bit 14 - - - -1
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature
T
T
Min.
SCK
SCK
15
15
15
—
—
—
—
—
—
20
20
/2
/2
PIC32MX5XX/6XX/7XX
SP21
SP20
Typ.
LSb In
—
—
—
—
—
—
—
—
—
—
—
—
—
LSb
(2)
SP20
SP21
Max.
—
—
—
—
—
—
15
20
—
—
—
—
—
-40°C ≤ T
Units
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
A
≤ +85°Cfor Industrial
See parameter DO32
See parameter DO31
See parameter DO32
See parameter DO31
V
V
V
V
V
V
DD
DD
DD
DD
DD
DD
DS61156F-page 201
> 2.7V
< 2.7V
> 2.7V
< 2.7V
> 2.7V
< 2.7V
Conditions
—
—
—
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