S29GL128P10TFI020 Spansion Inc., S29GL128P10TFI020 Datasheet - Page 14
S29GL128P10TFI020
Manufacturer Part Number
S29GL128P10TFI020
Description
IC 128M PAGE-MODE FLASH MEMORY
Manufacturer
Spansion Inc.
Datasheet
1.S29GL128P10TFI020.pdf
(80 pages)
Specifications of S29GL128P10TFI020
Cell Type
NOR
Density
128Mb
Access Time (max)
100ns
Interface Type
Parallel
Boot Type
Not Required
Address Bus
24/23Bit
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
TSOP
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8/16Bit
Number Of Words
16M/8M
Supply Current
110mA
Mounting
Surface Mount
Pin Count
56
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
S29GL128P10TFI020
Manufacturer:
FSC
Quantity:
13
Part Number:
S29GL128P10TFI020
Manufacturer:
SPANSION
Quantity:
20 000
Company:
Part Number:
S29GL128P10TFI020D
Manufacturer:
SPANSION
Quantity:
50 000
4.3
14
LAA064—64 ball Fortified Ball Grid Array, 11 x 13 mm
PACKAGE
JEDEC
SYMBOL
SD / SE
MD
ME
A1
A2
D1
E1
eD
eE
φb
D
N
A
E
0.40
0.60
0.50
MIN
---
13.00 mm x 11.00 mm
Figure 4.2 LAA064—64ball Fortified Ball Grid Array (FBGA), 11 x 13 mm
13.00 BSC.
11.00 BSC.
PACKAGE
7.00 BSC.
7.00 BSC.
1.00 BSC.
1.00 BSC.
0.50 BSC.
LAA 064
NONE
NOM
0.60
N/A
---
---
---
64
8
8
MAX
1.40
0.70
---
---
PROFILE HEIGHT
STANDOFF
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH - D DIRECTION
BALL PITCH - E DIRECTION
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
S29GL-P MirrorBit
NOTE
D a t a
®
Flash Family
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
4.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
6
7
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
AS NOTED).
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
BALLS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
S h e e t
S29GL-P_00_A13 November 17, 2010
3354 \ 16-038.12d