SST39LF040-55-4C-B3KE Microchip Technology, SST39LF040-55-4C-B3KE Datasheet - Page 22

• Manufacturer Part Number: SST39LF040-55-4C-B3KE
• Description: 3.0V To 3.6V 4Mbit Multi-Purpose Flash 48 TFBGA 6x8x1.2 Mm TRAY
• Manufacturer: Microchip Technology

Specifications of SST39LF040-55-4C-B3KE

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 4M (512K x 8)
• Speed: 55ns
• Interface: Parallel
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 48-TFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Data Sheet
©2010 Silicon Storage Technology, Inc.
FIGURE 23: 32-lead Thin Small Outline Package (TSOP) 8mm x 14mm
Note:
1. Complies with JEDEC publication 95 MO-142 BA dimensions,
2. All linear dimensions are in millimeters (max/min).
3. Coplanarity: 0.1 mm
4. Maximum allowable mold flash is 0.15 mm at the package ends, and 0.25 mm between leads.
0.70
0.50
although some dimensions may be more stringent.
SST Package Code: WH
Pin # 1 Identifier
12.50
12.30
14.20
13.80
SST39VF512 / SST39VF010 / SST39VF020 / SST39VF040
SST39LF512 / SST39LF010 / SST39LF020 / SST39LF040
512 Kbit / 1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
22
8.10
7.90
max.
1.20
DETAIL
1.05
0.95
1mm
0.15
0.05
BSC
0.50
0.27
0.17
0.70
0.50
0˚- 5˚
S71150-14-000
32-tsop-WH-7
01/10