UJA1069TW24/5V0/C: NXP Semiconductors, UJA1069TW24/5V0/C: Datasheet - Page 62

• Manufacturer Part Number: UJA1069TW24/5V0/C:
• Description: UJA1069TW24/HTSSOP24/REEL13DP/
• Manufacturer: NXP Semiconductors

Specifications of UJA1069TW24/5V0/C:

• Applications: *
• Interface: *
• Voltage - Supply: *
• Package / Case: 24-TSSOP Exposed Pad, 24-eTSSOP, 24-HTSSOP
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935285413518

NXP Semiconductors
14. Revision history
Table 29.
UJA1069_4
Product data sheet
Document ID
UJA1069_4
Modifications:
UJA1069_3
UJA1069_2
UJA1069_1
Revision history
Release date
20091028
20070910
20070305
20051222
•
•
•
•
•
•
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
3.3 V versions (UJA1069TW/3V3 and UJA1069TW24/3V3) discontinued
3.0 V versions (UJA1069TW/3V0 and UJA1069TW24/3V0) discontinued
Table
Section
Table
Figure
Fig 29. Temperature profiles for large and small components
24: table note section revised
10: text of bit 4, V1CMC, revised
23: unit corrected
6.2.5: text of third paragraph revised
temperature
MSL: Moisture Sensitivity Level
Data sheet status
Product data sheet
Product data sheet
Preliminary data sheet
Objective data sheet
Rev. 04 — 28 October 2009
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
Change notice
-
-
-
-
LIN fail-safe system basis chip
temperature
peak
Supersedes
UJA1069_3
UJA1069_2
UJA1069_1
-
UJA1069
© NXP B.V. 2009. All rights reserved.
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