MT47H32M16HR-25E IT:F Micron Technology Inc, MT47H32M16HR-25E IT:F Datasheet - Page 114
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MT47H32M16HR-25E IT:F
Manufacturer Part Number
MT47H32M16HR-25E IT:F
Description
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet
1.MT47H32M16HR-25E_ITF.pdf
(132 pages)
Specifications of MT47H32M16HR-25E IT:F
Organization
32Mx16
Density
512Mb
Address Bus
15b
Access Time (max)
400ps
Maximum Clock Rate
800MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
295mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Compliant
- Current page: 114 of 132
- Download datasheet (10Mb)
SELF REFRESH
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. R 12/10 EN
The SELF REFRESH command is initiated when CKE is LOW. The differential clock
should remain stable and meet
refresh mode. The procedure for exiting self refresh requires a sequence of commands.
First, the differential clock must be stable and meet
prior to CKE going back to HIGH. Once CKE is HIGH (
with three clock registrations), the DDR2 SDRAM must have NOP or DESELECT com-
mands issued for
ments is used to apply NOP or DESELECT commands for 200 clock cycles before
applying any other command.
t
XSNR. A simple algorithm for meeting both refresh and DLL require-
114
t
CKE specifications at least 1 ×
Micron Technology, Inc. reserves the right to change products or specifications without notice.
512Mb: x4, x8, x16 DDR2 SDRAM
t
CK specifications at least 1 ×
t
CKE [MIN] has been satisfied
© 2004 Micron Technology, Inc. All rights reserved.
t
CK after entering self
SELF REFRESH
t
CK
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