MT47H16M16BG-5E IT:B Micron Technology Inc, MT47H16M16BG-5E IT:B Datasheet - Page 101
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MT47H16M16BG-5E IT:B
Manufacturer Part Number
MT47H16M16BG-5E IT:B
Description
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet
1.MT47H16M16BG-5E_ITB.pdf
(128 pages)
Specifications of MT47H16M16BG-5E IT:B
Organization
16Mx16
Density
256Mb
Address Bus
15b
Access Time (max)
600ps
Maximum Clock Rate
400MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
140mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Compliant
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Figure 57: Consecutive WRITE-to-WRITE
Figure 58: Nonconsecutive WRITE-to-WRITE
PDF: 09005aef8117c187
256MbDDR2.pdf - Rev. M 7/09 EN
Notes:
Notes:
t DQSS (NOM)
t DQSS (NOM)
DQS, DQS#
DQS, DQS#
Command
Command
1. Subsequent rising DQS signals must align to the clock within
2. DI b, etc. = data-in for column b, etc.
3. Three subsequent elements of data-in are applied in the programmed order following
4. Three subsequent elements of data-in are applied in the programmed order following
5. Shown with BL = 4, AL = 0, CL = 3; thus, WL = 2.
6. Each WRITE command may be to any bank.
1. Subsequent rising DQS signals must align to the clock within
2. DI b (or n), etc. = data-in for column b (or column n).
3. Three subsequent elements of data-in are applied in the programmed order following
4. Three subsequent elements of data-in are applied in the programmed order following
5. Shown with BL = 4, AL = 0, CL = 3; thus, WL = 2.
6. Each WRITE command may be to any bank.
Address
Address
DI b.
DI n.
DI b.
DI n.
CK#
CK#
DM
DM
DQ
DQ
CK
CK
WRITE
WRITE
Bank,
Bank,
Col b
Col b
T0
T0
WL ±
WL = 2
t CCD
WL = 2
NOP
NOP
T1
T1
t
DQSS
WL ± t DQSS
T1n
101
WRITE
NOP
Bank,
Col n
T2
DI
b
T2
DI
b
T2n
T2n
Micron Technology, Inc. reserves the right to change products or specifications without notice.
WRITE
WL = 2
Bank,
Col n
T3
1
NOP
1
T3
256Mb: x4, x8, x16 DDR2 SDRAM
T3n
T3n
WL = 2
NOP
T4
NOP
T4
1
DI
n
Transitioning Data
Transitioning Data
T4n
T4n
1
NOP
T5
DI
n
NOP
1
T5
©2003 Micron Technology, Inc. All rights reserved.
t
t
DQSS.
DQSS.
T5n
T5n
NOP
1
T6
NOP
Don’t Care
T6
Don’t Care
T6n
WRITE
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