K4H560838F-ULB3 Samsung Semiconductor, K4H560838F-ULB3 Datasheet - Page 5
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K4H560838F-ULB3
Manufacturer Part Number
K4H560838F-ULB3
Description
Manufacturer
Samsung Semiconductor
Type
DDR SDRAMr
Datasheet
1.K4H560838F-ULB3.pdf
(23 pages)
Specifications of K4H560838F-ULB3
Organization
32Mx8
Density
256Mb
Address Bus
15b
Access Time (max)
700ps
Maximum Clock Rate
333MHz
Operating Supply Voltage (typ)
2.5V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
2.7V
Operating Supply Voltage (min)
2.3V
Supply Current
160mA
Pin Count
66
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Compliant
DDR SDRAM 256Mb F-die (x8, x16) Pb-Free
Package Physical Dimension
NOTE
1. (
2. [
] IS ASS’Y OUT QUALITY
) IS REFERENCE
(1.50)
#66
#1
(0.71)
66pin TSOPII / Package dimension
22.22±0.10
0.65±0.08
0.65TYP
0.30±0.08
(10×)
(10×)
#34
#33
[
0.075 MAX
0.10 MAX
Rev. 1.2 October, 2004
]
(10×)
0.125
Units : Millimeters
DDR SDRAM
+0.075
-0.035
0×~8×
(10×)
0.25TYP