ISD2532SYR Nuvoton Technology Corporation of America, ISD2532SYR Datasheet - Page 4
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ISD2532SYR
Manufacturer Part Number
ISD2532SYR
Description
Manufacturer
Nuvoton Technology Corporation of America
Datasheet
1.ISD2532SYR.pdf
(41 pages)
Specifications of ISD2532SYR
Lead Free Status / RoHS Status
Compliant
4. TABLE OF CONTENTS
1. GENERAL DESCRIPTION.................................................................................................................. 2
2. FEATURES ......................................................................................................................................... 2
3. BLOCK DIAGRAM .............................................................................................................................. 3
4. TABLE OF CONTENTS ...................................................................................................................... 4
5. PIN CONFIGURATION ....................................................................................................................... 5
6. PIN DESCRIPTION ............................................................................................................................. 6
7. FUNCTIONAL DESCRIPTION.......................................................................................................... 10
8. TIMING DIAGRAMS.......................................................................................................................... 16
9. ABSOLUTE MAXIMUM RATINGS.................................................................................................... 19
10. ELECTRICAL CHARACTERISTICS ............................................................................................... 21
11. TYPICAL APPLICATION CIRCUIT ................................................................................................. 30
12. PACKAGE DRAWING AND DIMENSIONS .................................................................................... 35
13. ORDERING INFORMATION........................................................................................................... 39
14. VERSION HISTORY ....................................................................................................................... 40
7.1. Detailed Description.................................................................................................................... 10
7.2. Operational Modes ..................................................................................................................... 11
9.1 Operating Conditions ................................................................................................................... 20
10.1. Parameters For Packaged Parts .............................................................................................. 21
10.2. Parameters For Die .................................................................................................................. 25
10.3. Parameters For Push-Button Mode.......................................................................................... 29
12.1. 28-Lead 300-Mil Plastic Small Outline IC (SOIC)..................................................................... 35
12.2. 28-Lead 600-Mil Plastic Dual Inline Package (PDIP) ............................................................... 36
12.3. Die Bonding Physical Layout
7.2.1. Operational Modes Description............................................................................................ 12
10.1.1. Typical Parameter Variation with Voltage and Temperature - Packaged Parts ................ 24
10.2.1. Typical Parameter Variation with Voltage and Temperature - Die .................................... 28
[1]
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ISD2532/40/48/64