HDSP2002LP OSRAM Opto Semiconductors Inc, HDSP2002LP Datasheet - Page 9

• Manufacturer Part Number: HDSP2002LP
• Description: LED Displays 5x7 Hi-Eff Red 0.15 , 4-CHARACTER
• Manufacturer: OSRAM Opto Semiconductors Inc

Specifications of HDSP2002LP

• Display Type: Dot Matrix
• Emitting Color: Hi-Eff. Red
• Number Of Digits: 4
• Digit Size (in): .15in
• Viewing Area Height (mm): 3.71mm
• Viewing Area Length (mm): 2.11mm
• Package Type: Panel
• Operating Supply Voltage (min): 4.75V
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (max): 5.25V
• Operating Temperature Classification: Industrial
• Operating Temp Range: -40C to 85C
• Mounting: Through Hole
• Pin Count: 12
• Total Thickness (mm): 3.81mm
• Opto Display Type: Panel
• Pattern Type: Dot Matrix
• Millicandela Rating: 1430µcd
• Size / Dimension: 0.70" L x 0.35" W x 0.20" H (17.75mm x 8.89mm x 5.08mm)
• Color: Red
• Configuration: 5 x 7
• Character Size: 0.15 in
• Illumination Color: High Efficiency Red
• Wavelength: 635 nm
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Luminous Intensity: 1430 ucd
• Viewing Area (w X H): 2.11 mm x 3.71 mm
• Lead Free Status / RoHS Status: Compliant
• Voltage - Forward (vf) Typ: -
• Internal Connection: -
• Lead Free Status / Rohs Status: Details
• Other names: Q68000A8132

Maximum Character Power Dissipation
Character Power Dissipation
2009-03-31
P
P
D
D
1.5
1.0
0.5
2.0
1.5
1.0
0.5
W
W
0
0
0
0
LEDs on per Character
LEDs on per Character
5
5
V
V
CC
COL
V
V
DF = 20%,
10
Duty Factor = 5%
10
CC
COL
= 5 V,
= 3.5 V,
= 5.25 V,
= 3.5 V,
15
15
I
CC
20
20
T
I
HDSP2000LP, HDSP2001LP, HDSP2002LP, HDSP2003LP
COL
= 5 mA
A
I
10%
17%
20%
I
= 25 ˚C
COL
25
CC
25
= 335 mA
= 10 mA
= 410 mA
30
30
IDDG5330
IDDG5331
35
35
40
40
9
Soldering Considerations
The HDSP200xLP can be hand soldered using a grounded iron
set to 260°C.
The display is compatible with leadfree and tin/lead solder. Wave
soldering is also possible following these conditions. Preheat does
not exceed 93°C on the solder side of the PC board or a package
surface temperature of 85°C. Water soluble organic acid flux (ex-
cept carboxylic acid) or resin-based RMA flux without alcohol can
be used.
Wave temperature of 245°C +/-5°C with a dwell between 1.5 sec. to
3 sec. Exposure to the wave should not exceed temperatures
above 260°C for five seconds at 0.063 inches below the seating
plane. The packages should not be immersed in the wave.