HCPL-0721-300 Avago Technologies US Inc., HCPL-0721-300 Datasheet - Page 5
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HCPL-0721-300
Manufacturer Part Number
HCPL-0721-300
Description
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HCPL-0721-300.pdf
(19 pages)
Specifications of HCPL-0721-300
Number Of Elements
1
Output Current
10mA
Package Type
SOIC
Operating Temp Range
-40C to 85C
Power Dissipation
150mW
Propagation Delay Time
40ns
Pin Count
8
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Output Type
Push-Pull
Isolation Voltage
3750Vrms
Lead Free Status / RoHS Status
Not Compliant
Solder Reflow Thermal Profile
Pb-Free IR Profile
Regulatory Information
The HCPL-772X/072X have been approved by the following organizations:
UL
Recognized under UL 1577, component recognition program, File E55361.
CSA
Approved under CSA Component Acceptance Notice #5, File CA88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884Teil 2):2003-01. (Option 060 only)
5
TEMPERATURE
ROOM
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
Note: Non-halide flux should be used.
Note: Non-halide flux should be used.
T
T
smax
smax
smin
300
200
100
T
T
25
p
L
0
= 200 °C, T
0
150 - 200 °C
217 °C
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
RAMP-UP
= 150 °C
t
50
s
260 +0/-5 °C
3°C + 1°C/–0.5°C
150°C, 90 + 30 SEC.
PREHEATING TIME
TIME
2.5°C ± 0.5°C/SEC.
100
t
TIME (SECONDS)
t
L
p
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
TEMP.
PEAK
245°C
RAMP-DOWN
6 °C/SEC. MAX.
150
SEC.
SEC.
30
30
50 SEC.
SOLDERING
200°C
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
250