LPC47N227-MV Standard Microsystems (SMSC), LPC47N227-MV Datasheet - Page 4

• Manufacturer Part Number: LPC47N227-MV
• Manufacturer: Standard Microsystems (SMSC)

Specifications of LPC47N227-MV

• Pin Count: 100
• Lead Free Status / RoHS Status: Compliant

100 Pin Super I/O with LPC Interface for Notebook Applications
Notes:
Rev. 03-29-07
1
2
3
4
1.08 mm.
5
6
Controlling Unit: millimeter
Tolerance on the position of the leads is ± 0.04 mm maximum.
Package body dimensions D1 and E1 do not include the mold protrusion.
Details of pin 1 identifier are optional but must be located within the zone indicated.
Shoulder widths must conform to JEDEC MS-026 dimension 'S' of a minimum of 0.20mm.
Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane is 0.78-
ccc
ccc
Maximum mold protrusion is 0.25 mm.
D/2
E/2
A1
A2
R1
R2
E1
L1
D1
θ
W
A
D
H
E
L
e
15.80
13.90
15.80
13.90
0.05
1.35
7.90
7.90
0.45
MIN
0
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FIGURE 1 – 100 PIN TQN LEAD-FREE PACKAGE OUTLINE
0.50 Basic
NOMINAL
16.00
14.00
16.00
14.00
1.40
8.00
0.60
1.00
0.25
0.20
0.20
8.00
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PRODUCT PREVIEW
PACKAGE OUTLINES
0.0762
16.20
14.10
16.20
14.10
MAX
1.60
1.45
8.10
8.10
0.20
0.75
0.08
8
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Page 4
1
1
Lead Foot Length from Centerline
/
/
2
2
X Span Measure from Centerline
Y Span Measure from Centerline
Coplanarity (Assemblers)
Coplanarity (Test House)
Overall Package Height
Lead Frame Thickness
Lead Shoulder Radius
Lead Foot Radius
Lead Foot Angle
Body Thickness
Lead Length
X body Size
Y body Size
Lead Width
Lead Pitch
REMARK
Standoff
X Span
Y Span
SMSC DB – LPC47N227