EVB-2502 Standard Microsystems (SMSC), EVB-2502 Datasheet - Page 44

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EVB-2502

Manufacturer Part Number
EVB-2502
Description
Manufacturer
Standard Microsystems (SMSC)
Datasheet

Specifications of EVB-2502

Lead Free Status / RoHS Status
Supplier Unconfirmed
Revision 2.3 (08-27-07)
ccc
A1
A2
E1
R1
R2
L1
D1
W
D
H
A
E
e
θ
L
Notes:
1. Controlling Unit: millimeter.
2. Tolerance on the true position of the leads is ± 0.04 mm maximum.
3. Package body dimensions D1 and E1 do not include the mold protrusion.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5.
0.05
1.35
8.80
6.90
8.80
6.90
0.09
0.45
0.17
0.08
0.08
MIN
Figure 9.2 48 Pin TQFP Package Outline (7x7x1.4 mm body, 2mm Footprint)
0
~
~
~
Maximum mold protrusion is 0.25 mm.
Details of pin 1 identifier are optional but must be located within the zone indicated
o
0.50 Basic
NOMINAL
0.60
1.00
0.22
~
~
~
~
~
~
~
~
~
~
~
~
Table 9.1 48 Pin TQFP Package
MAX
1.60
0.15
1.45
9.20
7.10
9.20
7.10
0.20
0.75
0.27
0.20
0.08
DATASHEET
7
~
~
o
44
Overall Package Height
Lead Frame Thickness
Lead Shoulder Radius
Lead Foot Length
Lead Foot Radius
Lead Foot Angle
Body Thickness
Lead Length
X body Size
Y body Size
REMARKS
Lead Width
Coplanarity
Lead Pitch
Standoff
X Span
Y Span
2-Port USB 2.0 Hub Controller
SMSC USB2502
Datasheet
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