LTC3250ES6-1.2 Linear Technology, LTC3250ES6-1.2 Datasheet - Page 9

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LTC3250ES6-1.2

Manufacturer Part Number
LTC3250ES6-1.2
Description
Manufacturer
Linear Technology
Type
Step Downr
Datasheet

Specifications of LTC3250ES6-1.2

Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
5.5V
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Package Type
TSOT-23
Pin Count
6
Mounting
Surface Mount
Output Voltage
1.2V
Output Current
250mA
Lead Free Status / RoHS Status
Not Compliant

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Part Number
Manufacturer
Quantity
Price
Part Number:
LTC3250ES6-1.2
Manufacturer:
LT
Quantity:
10 000
Part Number:
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Manufacturer:
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Quantity:
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Part Number:
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0
OPERATIO
Thermal Management
For higher input voltages and maximum output current
there can be substantial power dissipation in the
LTC3250-1.5/LTC3250-1.2. If the junction temperature
increases above approximately 160 C the thermal shut-
down circuitry will automatically deactivate the output. To
reduce the maximum junction temperature, a good ther-
mal connection to the PC board is recommended. Con-
necting the GND pin (Pin 2) to a ground plane, and
maintaining a solid ground plane under the device can
reduce the thermal resistance of the package and PC board
considerably.
Derating Power at Higher Temperatures
To prevent an overtemperature condition in high power
applications Figure 3 should be used to determine the
maximum combination of ambient temperature and power
U
(Refer to Simplified Block Diagram)
Figure 3. Maximum Power Dissipation vs Ambient Temperature
1.2
1.0
0.8
0.6
0.4
0.2
0
–50
–25
AMBIENT TEMPERATURE ( C)
0
25
dissipation. The power dissipated in the LTC3250-1.5/
LTC3250-1.2 should always fall under the line shown (i.e.
within the safe region) for a given ambient temperature.
The power dissipated in the LTC3250-1.5/LTC3250-1.2 is
given by the expression:
This derating curve assumes a maximum thermal resis-
tance,
thermal resistances can be achieved from a printed circuit
board layout with a solid ground plane (2000mm
least one layer with a good thermal connection to the
ground pin of the LTC3250-1.5/LTC3250-1.2. Operation
outside of this curve will cause the junction temperature to
exceed 140 C which may trigger the thermal shutdown
circuitry and ultimately reduce the life of the device.
P
D
50
T
LTC3250-1.5/LTC3250-1.2
JA
J
= 140 C
= 175 C/W
JA
75
V
2
3250 • F03
IN
, of 175 C/W for the 6-pin ThinSOT-23. This
100
V
OUT
I
OUT
2
)on at
3250fa
9

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