BSP 75 Infineon Technologies, BSP 75 Datasheet

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BSP 75

Manufacturer Part Number
BSP 75
Description
Manufacturer
Infineon Technologies
Datasheet

Specifications of BSP 75

Switch Type
Low Side
Power Switch Family
BSP75
Input Voltage
-0.2 to 10V
Power Switch On Resistance
550mOhm
Output Current
700mA
Number Of Outputs
Single
Mounting
Surface Mount
Package Type
SOT-223
Operating Temperature (min)
-40C
Operating Temperature (max)
150C
Operating Temperature Classification
Automotive
Pin Count
3 +Tab
Power Dissipation
1.8W
Lead Free Status / RoHS Status
Supplier Unconfirmed
Smart Lowside Power Switch
Features
• Logic Level Input
• Input protection (ESD)
• Thermal shutdown (with restart)
• Overload protection
• Short circuit protection
• Overvoltage protection
• Current limitation
Application
• All kinds of resistive, inductive and capacitive loads in switching applications
• µC compatible power switch for 12 V and 24 V DC applications
• Replaces electromechanical relays and discrete circuits
General Description
N channel vertical power FET in Smart Power Technology. Fully protected by embedded
protection functions.
Semiconductor Group
1
IN
ESD
TAB
Pin
1
2
3
limitation
dv/dt
SUBSTRATE
SOURCE
Symbol
DRAIN
IN
temperature
protection
Product Summary
Continuous drain source voltage V
On-state resistance
Current limitation
Nominal load current
Clamping energy
Over-
Page 1 of 9
4
Overvoltage
Short circuit
protection
Short circuit
protection
protection
limitation
Current
Must be connected to Pin 3
Output to the load
HITFET
Function
Source
Ground
Drain
Input
LOAD
3
2
R
I
I
E
V bb
D(lim)
D(Nom)
DS
AS
DS(ON)
+
HITFET ® BSP 75
2000-05-19
550
550
0.7
55
1
M
mΩ
mJ
V
A
A

Related parts for BSP 75

BSP 75 Summary of contents

Page 1

... Nominal load current Clamping energy Overvoltage protection Short circuit protection Over- temperature Short circuit Current protection protection limitation 4 Symbol IN DRAIN SOURCE Must be connected to Pin 3 Page HITFET ® BSP DS(ON) I D(lim) I D(Nom LOAD Drain 2 3 Source HITFET Function Input Output to the load ...

Page 2

... DUT connected to the generator per ISO 7637-1 and DIN 40 839. LoadDump ) Device on epoxy pcb 40mm 1.5mm with 6cm 3 Semiconductor Group = =13 =50 Ω =22 Ω junction soldering point junction - ambient : 2 copper area for pin 4 connection Page 2 HITFET ® BSP 75 Symbol Values LoadDump -0.2 ... + -0.2 ... + -40 ...+150 j -55 ...+150 T ...

Page 3

... =150° =25° =150° 85° Page 3 HITFET ® BSP 75 Symbol Values min typ 55 -- DS(AZ DSS 2 2.5 IN(th) -- 100 IN(1) -- 200 IN(2) 1000 1500 IN(3) -- 550 DS(on) -- 850 -- 475 DS(on) -- 750 0.7 -- D(Nom) 1 1.5 D(lim off /dt -- ...

Page 4

... 2*0 The BSP monolithic power switch in Smart Power Technology (SPT) with a logic level input, an open drain DMOS output stage and integrated protection functions designed for all kind of resistive and inductive loads (relays, solenoid) in automotive and industrial ap- plications. Protection functions • Overvoltage protection: An internal clamp limits the output voltage when inductive loads are switched off. • ...

Page 5

... ESD-ZD I Source ESD zener diodes are not designed for DC current. Semiconductor Group Inductive and overvoltage output clamp Turn on into overload or short circuit D(lim) Shut down by overtemperature and restart by cooling. Current internally limited at I Page 5 HITFET ® BSP HITFET V DS(AZ D(lim) 2000-05-19 ...

Page 6

... T [°C] C Typ. input threshold voltage IN(th) V IN(th) 3 2.5 2 1 100 125 150 -50 T [°C] j Page 6 HITFET ® BSP 0 typ . - 100 125 150 ); mA [V] - 100 125 150 2000-05-19 T [° [°C] j ...

Page 7

... V IN [V] Transient thermal impendance Z = 25°C thJC j Parameter: D thJC 1E+2 1E+1 1E+0 1E-1 1E [V] Page 7 HITFET ® BSP =12V 10V IN [A] - 100 125 150 = [K/W] D= 0.5 0.2 0.1 0.05 0.01 0.02 P tot t p 0.005 [° [s] 2000-05-19 ...

Page 8

... Application examples: Status signal of thermal shutdown by monitoring input current HITFET µC µ Semiconductor Group ∆ V thermal shutdown Page 8 HITFET ® BSP 75 2000-05-19 ...

Page 9

... Package and ordering code all dimensions in mm Package P-SOT223-4-7 Q67060-S7200-A2 Definition of soldering point with temperature T upper side of solder edge of device pin 4. Pin 4 Semiconductor Group Ordering code : s Page 9 HITFET ® BSP 75 2000-05-19 ...

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