ZICM0900P2-1C-SN California Eastern Labs, ZICM0900P2-1C-SN Datasheet
ZICM0900P2-1C-SN
Specifications of ZICM0900P2-1C-SN
Related parts for ZICM0900P2-1C-SN
ZICM0900P2-1C-SN Summary of contents
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... Document No: 0009-00-07-00-000 (Issue ES) Date Published: March 18, 2011 PRELIMINARY DATA SHEET MeshConnect™ Sub-G Module Series 868 / 900 MHz System-on-Chip (SoC) Based Modules ZICM0868P0-KIT1-1 and ZICM0900P2-KIT1-1 MeshConnect ZICM0868P0 • Long Range • Low Power Consumption • 868 and 900 MHz Frequency Ranges • ...
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... ZICM0900P2-1CU ZICM0900P2-1CS ZICM0900P2-1C MeshConnect™ ZICM0900P2-1CU-SN Sub-G Module (902-928 MHz) ZICM0900P2-1CS-SN ZICM0900P2-1C-SN ZICM0868P0-KIT1-1 MeshConnect™ Sub-G Development Kits ZICM0900P2-KIT1-1 MeshConnect™ Sub-G Module Series Description 868 MHz Module, +13dBm SoC with U.FL connector for external antenna 868 MHz Module, +13dBm SoC with RP-SMA connector for external antenna 868 MHz Module, +13dBm SoC with 1/4 wave wire antenna 900 MHz Module, +20dBm SoC with U ...
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... CEL’s website: http://MeshConnect.cel.com) DEVELOPMENT KIT ORDERING INFORMATION Part Number Order Number ZICM0868P0-KIT1-1 MeshConnect™ Sub-G Development Kits ZICM0900P2-KIT1-1 MeshConnect™ Sub-G Module Series ANT MeshConnect Sub-G Module Development Kit Kit Contents: • Evaluation Boards (2) • MeshConnect Sub-G Modules w/Daughter Cards (4) ...
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TABLE OF CONTENTS Introduction and Overview Description.............................................................................................................................................................................................. Features.................................................................................................................................................................................................. Applications............................................................................................................................................................................................ Ordering Information............................................................................................................................................................................. Module Block Diagram........................................................................................................................................................................... Development Kit..................................................................................................................................................................................... System Level Function Transceiver IC......................................................................................................................................................................................... Antenna................................................................................................................................................................................................... Additional Flash Memory....................................................................................................................................................................... Electrical Specification Absolute Maximum Ratings................................................................................................................................................................... Recommended (Operating Condition).................................................................................................................................................. DC Characteristics.................................................................................................................................................................................. RF Characteristics.................................................................................................................................................................................. Pin Signal & Interfaces Pin Signals I/O Configuration................................................................................................................................................................ I/O Pin Assignment................................................................................................................................................................................. Software/Firmware.................................................................................................................................................................................. Module ...
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TRANSCEIVER IC The MeshConnect Sub-G modules are based on the Silicon Labs Si1000 and Si1002 wireless SoCs ICs. These devices incorporate the RF transceiver with the baseband modem, a hardwired MAC, and an embedded 8051 microcontroller, offering a high performance ...
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... Note: Exceeding the maximum ratings may cause permanent damage to the module or devices. RECOMMENDED (OPERATING CONDITIONS) Description Power Supply Voltage ( Frequency Range (ZICM0868P0) Frequency Range (ZICM0900P2) Ambient Temperature Range Note: * 2.7v is the min voltage if an additional memory IC was ordered. DC CHARACTERISTICS (@ 25°C, V Description Transmit Mode Current (@ 13dBm) ...
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... ZICM0900P2) DD MeshConnect™ Sub-G Module Min Typ Max – 902 928 – – 19 – -5 – – 15 – – 75 – – -99 – – ...
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PIN SIGNALS I/O PORT CONFIGURATION MeshConnect module has 56 edge I/O interfaces for connection to the user’s host board. shows the layout of the 56 edge castellations. MeshConnect I/O PIN ASSIGNMENTS Number Name 1 GND 2 GND 3 GND 4 ...
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MeshConnect I/O PIN ASSIGNMENTS Number Name GND 38 GND 39 GND 40 GND 41 GND 42 P2.2 GPIO connected to LED2 on CEL Eval board 43 P2.1 GPIO connected to Switch 1 on CEL Eval ...
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SOFTWARE/FIRMWARE (Continued) • Self Healing (Orphan handling) • Point-to-Point network formation • Point-to-Multipoint (Star) network formation • Mesh network formation* • ACK • Wakeup Modes (Si100X) • Frequency Hopping • Unicast Addressing using 16-bit device IDs • Broadcast Addressing • ...
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MODULE LAND FOOTPRINT Note: Unless otherwise specified. Dimensions are in Inches [mm]. 1.413 1.300 1.200 1.100 1.021 1.005 1 .0.150 Ø 0.065 19 0.050 0.000 20 EVALUATION BOARD CEL provides an Evaluation board to allow easy testing of the Module. ...
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PROCESSING Recommended Reflow Profile Parameters Values Ramp up rate (from Tsoakmax to Tpeak) Minimum Soak Temperature Maximum Soak Temperature Soak Time TLiquidus Time above TL Tpeak Time within 5º of Tpeak Time from 25º to Tpeak Ramp down rate Pb-Free Solder Paste ...
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PROCESSING (Continued) Hand Soldering Hand soldering is possible. When using a soldering iron, follow IPC recommendations (reference document IPC-7711) Rework The MeshConnect Module can be unsoldered from the host board. Use of a hot air rework tool should be programmable ...
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AGENCY CERTIFICATIONS (Continued) IC Certification — Industry Canada Statement The term "IC" before the certification / registration number only signifies that the Industry Canada technical specifications were met. Section 14 of RSS-210 The installer of this radio equipment must ensure that the antenna is located or pointed such ...
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SHIPMENT, HANDLING, AND STORAGE Shipment The MeshConnect Modules are delivered in trays of 28. Handling The MeshConnect Modules are designed and packaged to be processed in an automated assembly line. Warning The MeshConnect Modules contain highly sensitive electronic circuitry. Handling ...
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REFERENCES & REVISION HISTORY Previous Versions Changes to Current Version 0008-00-07-00-000 Initial preliminary datasheet. (Issue ES) March 18, 2011 Disclaimer • The information in this document is current as of the published date. The information is subject to change without notice. For actual ...