5962-9451002MXA QP SEMICONDUCTOR, 5962-9451002MXA Datasheet - Page 4

• Manufacturer Part Number: 5962-9451002MXA
• Manufacturer: QP SEMICONDUCTOR

Specifications of 5962-9451002MXA

• Lead Free Status / RoHS Status: Supplier Unconfirmed

DSCC FORM 2234
APR 97
Unless otherwise specified, the issues of these documents are those cited in the solicitation.
(Applications for copies of ASTM publications should be addressed to:
Harbor Drive, West Conshohocken, PA 19428-2959; http://www.astm.org.)
ELECTRONICS INDUSTRIES ASSOCIATION (EIA)
22201; http://www.jedec.org.)
documents. These documents also may be available in or through libraries or other informational services.)
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless
a specific exemption has been obtained.
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
shall be as specified on figure 2. When required in screening (see 4.2 herein) or quality conformance inspection group A, C, D,
or E (see 4.4 herein), the devices shall be programmed by the manufacturer prior to test with a minimum of 50 percent of the
total number of gates programmed or to any altered item drawing pattern which includes at least 25 percent of the total number
of gates programmed.
drawing.
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
case operating temperature range.
tests for each subgroup are defined in table I.
2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.
AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)
(Applications for copies should be addressed to the Electronics Industries Association, 2500 Wilson Boulevard, Arlington, VA
(Non-Government standards and other publications are normally available from the organizations that prepare or distribute the
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
3.2.3 Truth table(s).
3.2.3.1 Unprogrammed devices. The truth table for unprogrammed devices for contracts involving no altered item drawing
3.2.3.2 Programmed devices. The requirements for supplying programmed devices shall be as specified by an attached item
ASTM Standard F1192-00
JEDEC Standard EIA/JESD78
DEFENSE SUPPLY CENTER COLUMBUS
MICROCIRCUIT DRAWING
COLUMBUS, OHIO 43218-3990
STANDARD
-
Standard Guide for the Measurement of Single Event Phenomena from
Heavy Ion Irradiation of Semiconductor Devices.
-
IC Latch-Up Test.
SIZE
ASTM International, PO Box C700, 100 Barr
A
REVISION LEVEL
A
SHEET
5962-94510
4