UPD8871CY Renesas Electronics America, UPD8871CY Datasheet - Page 21

• Manufacturer Part Number: UPD8871CY
• Manufacturer: Renesas Electronics America

Specifications of UPD8871CY

• Lead Free Status / RoHS Status: Supplier Unconfirmed

RECOMMENDED SOLDERING CONDITIONS
to consult with our sales offices.
Type of Through-hole Device
Cautions 1. During assembly care should be taken to prevent solder or flux from contacting the plastic cap.
When soldering this product, it is highly recommended to observe the conditions as shown below.
If other soldering processes are used, or if the soldering is performed under different conditions, please make sure
µ
Partial heating method
PD8871CY-A : CCD linear image sensor 32-pin plastic DIP (10.16 mm (400))
2. Soldering by the solder flow method may have deleterious effects on prevention of plastic cap
Process
The optical characteristics could be degraded by such contact.
soiling and heat resistance. So the method cannot be guaranteed.
Pin temperature : 300°C or below, Heat time : 3 seconds or less (per pin)
Data Sheet S15329EJ3V0DS
Conditions
µ
PD8871
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