UPD3737D Renesas Electronics America, UPD3737D Datasheet - Page 17

• Manufacturer Part Number: UPD3737D
• Manufacturer: Renesas Electronics America

Specifications of UPD3737D

• Lead Free Status / RoHS Status: Supplier Unconfirmed

RECOMMENDED SOLDERING CONDITIONS
to consult with our sales offices.
Type of Through-hole Device
Cautions 1.
When soldering this product, it is highly recommended to observe the conditions as shown below.
If other soldering processes are used, or if the soldering is performed under different conditions, please make sure
µ
Partial heating method
PD3737CY-A : CCD linear image sensor 32-pin plastic DIP (10.16 mm (400))
2.
Process
During assembly care should be taken to prevent solder or flux from contacting the glass
cap. The optical characteristics could be degraded by such contact.
Soldering by the solder flow method may have deleterious effects on prevention of glass cap
soiling and heat resistance. So the method cannot be guaranteed.
Pin temperature : 350 °C or below, Heat time : 3 seconds or less (per pin)
Data Sheet S13158EJ4V0DS
Conditions
µ
PD3737
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