UPD3739D Renesas Electronics America, UPD3739D Datasheet - Page 22

• Manufacturer Part Number: UPD3739D
• Manufacturer: Renesas Electronics America

Specifications of UPD3739D

• Lead Free Status / RoHS Status: Supplier Unconfirmed

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RECOMMENDED SOLDERING CONDITIONS
to consult with our sales offices.
Type of Through-hole Device
μ
Cautions 1. During assembly care should be taken to prevent solder or flux from contacting the glass cap.
20
Partial heating method
PD3739D-A: CCD linear image sensor 22-pin ceramic DIP (CERDIP) (10.16 mm (400))
When soldering this product, it is highly recommended to observe the conditions as shown below.
If other soldering processes are used, or if the soldering is performed under different conditions, please make sure
Process
2. Soldering by the solder flow method may have deleterious effects on prevention of glass cap
The optical characteristics could be degraded by such contact.
soiling and heat resistance. So the method cannot be guaranteed.
Pin temperature: 380°C or below, Heat time: 3 seconds or less (per pin).
Data Sheet S12744EJ4V0DS
Conditions
μ
PD3739