UPD8861CY Renesas Electronics America, UPD8861CY Datasheet - Page 20

• Manufacturer Part Number: UPD8861CY
• Manufacturer: Renesas Electronics America

Specifications of UPD8861CY

• Lead Free Status / RoHS Status: Supplier Unconfirmed

RECOMMENDED SOLDERING CONDITIONS
to consult with our sales offices.
Type of Through-hole Device
18
Partial heating method
When soldering this product, it is highly recommended to observe the conditions as shown below.
If other soldering processes are used, or if the soldering is performed under different conditions, please make sure
Caution s 1.
µ
PD8861CY-A : CCD linear image sensor 22-pin plastic DIP (10.16 mm (400))
2.
Process
During assembly care should be taken to prevent solder or flux from contacting the plastic
cap. The optical characteristics could be degraded by such contact.
Soldering by the solder flow method may have deleterious effects on prevention of plastic
cap soiling and heat resistance. So the method cannot be guaranteed.
Pin temperature : 300 °C or below, Heat time : 3 seconds or less (per pin)
Data Sheet S15167EJ4V0DS
Conditions
µ
PD8861