LX1970IDU MICROSEMI, LX1970IDU Datasheet - Page 9

• Manufacturer Part Number: LX1970IDU
• Manufacturer: MICROSEMI

Specifications of LX1970IDU

• Lead Free Status / RoHS Status: Compliant

Copyright © 2007
Rev. 1.5b, 2008-01-25
S
DU
A1
I N T E G R A T E D
8-Pin Miniature Shrink Outline Package (MSOP)
A
D
C
L
b
B
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: [phone]
P1
e
Top View
A
E1
Side Views
C
L
P R O D U C T S
L
Active Area
Required Minimum Light footprint
Bonding / Wafer area
C
Examination of
Active Area
P A C K A G E D I M E N S I O N S
D
E
Active Area
Analog Mixed Signal Group
Microsemi
L1
c
Θ
Note:
C
P1 represents a possible light footprint and its
dimensions are not subject to strict tolerances. Only the
active area of the device is required to be covered with
light. This larger footprint is designed to ensure
coverage of the device’s active area.
L
Dim
Dim
A1
E1
L1
P1
is the center of the package
Θ
A
D
E
S
b
e
L
C
D
c
A
B
P
Visible Light Sensor
RODUCTION
0.05
0.26
0.13
2.90
4.75
2.90
0.41
MIN
M
0.525 BSC
–
M
0.65 BSC
0.95 BSC
ILLIMETERS
ILLIMETERS
0.225
0.145
0.600
0.612
3°
2.5
MAX
D
1.10
0.15
0.41
0.23
3.10
5.05
3.10
0.71
ATA
S
HEET
0.002
0.010
0.005
0.114
0.187
0.114
0.016
MIN
0.025 BSC
0.037 BSC
0.021 BSC
–
I
NCHES
I
0.0088
0.0057
0.0236
0.0241
NCHES
3°
0.98
0.043
0.006
0.016
0.009
0.122
0.198
0.122
0.028
MAX
LX1970
Page 9