BAP51-03T NXP Semiconductors, BAP51-03T Datasheet - Page 3

BAP51-03T

Manufacturer Part Number
BAP51-03T
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAP51-03T

Configuration
Single
Forward Current
50mA
Forward Voltage
1.1V
Power Dissipation
500mW
Operating Temperature Classification
Military
Reverse Voltage
50V
Package Type
SOD-323
Mounting
Surface Mount
Maximum Series Resistance @ Minimum If
9@0.5mAOhm
Maximum Series Resistance @ Maximum If
2.5@10mAOhm
Typical Carrier Life Time
550ns
Operating Temperature (max)
150C
Operating Temperature (min)
-65C
Pin Count
2
Lead Free Status / RoHS Status
Compliant
NXP Semiconductors
ELECTRICAL CHARACTERISTICS
T
Note
1. Guaranteed on AQL basis: inspection level S4, AQL 1.0.
THERMAL CHARACTERISTICS
2004 Feb 11
V
V
I
C
r
R
j
SYMBOL
R
SYMBOL
D
L
= 25 C unless otherwise specified.
F
R
General purpose PIN diode
d
th(j-s)
forward voltage
reverse voltage
reverse current
diode capacitance
diode forward resistance
charge carrier life time
thermal resistance from junction to soldering point
PARAMETER
PARAMETER
I
I
V
V
V
V
I
I
I
when switched from I
I
at I
F
R
F
F
F
R
R
R
R
R
= 50 mA
= 0.5 mA; f = 100 MHz; note 1
= 1 mA; f = 100 MHz; note 1
= 10 mA; f = 100 MHz; note 1
= 10 A
= 6 mA; R
R
= 50 V
= 0; f = 1 MHz
= 1 V; f = 1 MHz
= 5 V; f = 1 MHz
= 3 mA
3
CONDITIONS
L
= 100 ; measured
F
= 10 mA to
50
MIN.
0.95
0.4
0.3
0.2
5.5
3.6
1.5
550
TYP.
VALUE
120
Product specification
BAP51-03
1.1
100
0.55
0.35
9
6.5
2.5
MAX.
UNIT
K/W
V
V
nA
pF
pF
pF
ns
UNIT

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