BAP50-04T NXP Semiconductors, BAP50-04T Datasheet

BAP50-04T

Manufacturer Part Number
BAP50-04T
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAP50-04T

Configuration
Dual Series
Forward Current
50mA
Forward Voltage
1.1V
Power Dissipation
250mW
Operating Temperature Classification
Military
Reverse Voltage
50V
Package Type
SOT-23
Mounting
Surface Mount
Maximum Series Resistance @ Minimum If
40@0.5mAOhm
Maximum Series Resistance @ Maximum If
5@10mAOhm
Typical Carrier Life Time
1.05us
Operating Temperature (max)
150C
Operating Temperature (min)
-65C
Pin Count
3
Lead Free Status / RoHS Status
Compliant
Product specification
Supersedes data of 1999 May 10
DATA SHEET
BAP50-04
General purpose PIN diode
ok, halfpage
DISCRETE SEMICONDUCTORS
M3D088
1999 Dec 03

Related parts for BAP50-04T

BAP50-04T Summary of contents

Page 1

... DATA SHEET ok, halfpage BAP50-04 General purpose PIN diode Product specification Supersedes data of 1999 May 10 DISCRETE SEMICONDUCTORS M3D088 1999 Dec 03 ...

Page 2

... T storage temperature stg T junction temperature j 1999 Dec 03 PINNING PIN handbook, halfpage 2 3 Marking code: 4Lp. Fig.1 Simplified outline (SOT23) and symbol. CONDITIONS = 90  Product specification BAP50-04 DESCRIPTION anode cathode common connection MAM232 MIN. MAX. UNIT    250 mW 65 C +150  ...

Page 3

... I = 0.5 mA 100 MHz; note mA 100 MHz; note mA 100 MHz; note 1 F when switched from 100 ; measured PARAMETER 3 Product specification BAP50-04 MIN. TYP. MAX. UNIT  0.95 1.1   50   100   0.45  0.35 0.6  0.3 0.5  ...

Page 4

... Diode capacitance as a function of reverse voltage; typical values (dB) −5 −10 −15 −20 −25 0.5 1 1.5 2 Diode zero biased and inserted in series with a 50  stripline circuit C. T amb  2 Fig.5 Isolation ( the diode in off-state function of frequency; typical values. Product specification BAP50-04 MGL927 (V) MGS320 2 (GHz) ...

Page 5

... OUTLINE VERSION IEC SOT23 1999 Dec scale 3.0 1.4 2.5 1.9 0.95 2.8 1.2 2.1 REFERENCES JEDEC JEITA TO-236AB 5 Product specification detail 0.45 0.55 0.2 0.1 0.15 0.45 EUROPEAN PROJECTION BAP50-04 SOT23 ISSUE DATE 04-11-04 06-03-16 ...

Page 6

... Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. 6 Product specification BAP50-04 DEFINITION ...

Page 7

... NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 7 Product specification BAP50-04 ...

Page 8

... Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. ...

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