BAP50-05W T/R NXP Semiconductors, BAP50-05W T/R Datasheet

PIN Diodes PIN GP 50V 50MA

BAP50-05W T/R

Manufacturer Part Number
BAP50-05W T/R
Description
PIN Diodes PIN GP 50V 50MA
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAP50-05W T/R

Configuration
Dual Common Cathode
Reverse Voltage
50V
Maximum Series Resistance @ Maximum If
5@10mAOhm
Maximum Series Resistance @ Minimum If
40@0.5mAOhm
Power Dissipation
240mW
Forward Current
50mA
Forward Voltage
1.1V
Operating Temperature Classification
Military
Package Type
SC-70
Mounting
Surface Mount
Typical Carrier Life Time
1.05us
Operating Temperature (max)
150C
Operating Temperature (min)
-65C
Pin Count
3
Forward Continuous Current
50 mA
Carrier Life
1.05 us
Forward Voltage Drop
1.1 V
Maximum Diode Capacitance
0.5 pF at 5 V
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 65 C
Mounting Style
SMD/SMT
Package / Case
SOT-323
Lead Free Status / RoHS Status
Compliant
Other names
BAP50-05W,115
Product specification
Supersedes data of 2001 Mar 02
DATA SHEET
BAP50-05W
General purpose PIN diode
ok, halfpage
DISCRETE SEMICONDUCTORS
M3D102
2001 Apr 17

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BAP50-05W T/R Summary of contents

Page 1

... DATA SHEET ok, halfpage BAP50-05W General purpose PIN diode Product specification Supersedes data of 2001 Mar 02 DISCRETE SEMICONDUCTORS M3D102 2001 Apr 17 ...

Page 2

... T storage temperature stg T junction temperature j 2001 Apr 17 PINNING PIN handbook, halfpage 1 Top view Marking code: W4-. Fig.1 Simplified outline (SOT323) and symbol. CONDITIONS = 90  Product specification BAP50-05W DESCRIPTION anode anode common cathode MAM382 MIN. MAX. UNIT    240 mW 65  ...

Page 3

... MHz mA 900 MHz mA 1800 MHz mA 2450 MHz F when switched from 100  mA measured 100 mA 100 MHz F PARAMETER 3 Product specification BAP50-05W MIN. TYP. MAX. UNIT  0.95 1.1 V     100 nA   0.45 pF  0.35 0.6 pF  0.3 0.5 pF  ...

Page 4

... Diode capacitance as a function of reverse voltage; typical values (dB) −5 −10 −15 −20 −25 0.5 1 1.5 2 Diode zero biased and inserted in series with a 50  stripline circuit C. T amb  2 Isolation ( the diode in off-state function of frequency; typical values. Product specification BAP50-05W MLD606 (V) MLD608 2 (GHz) ...

Page 5

... OUTLINE VERSION IEC SOT323 2001 Apr scale 2.2 1.35 2.2 1.3 0.65 1.8 1.15 2.0 REFERENCES JEDEC JEITA SC- detail 0.45 0.23 0.2 0.2 0.15 0.13 EUROPEAN PROJECTION Product specification BAP50-05W SOT323 ISSUE DATE 04-11-04 06-03-16 ...

Page 6

... Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. 6 Product specification BAP50-05W DEFINITION ...

Page 7

... NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 7 Product specification BAP50-05W ...

Page 8

... Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. ...

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