BAP1321-03 NXP Semiconductors, BAP1321-03 Datasheet - Page 2

• Manufacturer Part Number: BAP1321-03
• Description: Planar PIN diode in a SOD323 (SC-76) ultra small SMD plastic package
• Manufacturer: NXP Semiconductors
• Type: Attenuator/Switchr

Specifications of BAP1321-03

• Configuration: Single
• Forward Current: 100mA
• Forward Voltage: 1.1V
• Power Dissipation: 500mW
• Operating Temperature Classification: Military
• Package Type: SOD-323
• Mounting: Surface Mount
• Operating Temperature (max): 150C
• Operating Temperature (min): -65C
• Pin Count: 2
• Applications Frequency Range: UHF/SHF
• Lead Free Status / RoHS Status: Compliant

NXP Semiconductors
FEATURES
 High voltage, current controlled
 RF resistor for RF attenuators and switches
 Low diode capacitance
 Low diode forward resistance
 Very low series inductance
 For applications up to 3 GHz.
APPLICATIONS
 RF attenuators and switches.
DESCRIPTION
Planar PIN diode in a SOD323 (SC-76) ultra small SMD
plastic package.
ORDERING INFORMATION
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
2004 Feb 17
BAP1321-03
V
I
P
T
T
F
stg
j
R
tot
Silicon PIN diode
NUMBER
SYMBOL
TYPE
continuous reverse voltage
continuous forward current
total power dissipation
storage temperature
junction temperature
NAME

PARAMETER
plastic surface mounted package; 2 leads
T
s
 90 C
2
DESCRIPTION
PINNING
PACKAGE
Marking code: V8.
The marking bar indicates the cathode.
Fig.1
CONDITIONS
1
Simplified outline (SOD323; SC-76) and
symbol.
PIN
1
2
2
cathode
anode



65
65
MIN.
Product specification
DESCRIPTION
BAP1321-03
60
100
500
+150
+150
MAX.
sym006
VERSION
SOD323
V
mA
mW
C
C
UNIT