BAP51-03 NXP Semiconductors, BAP51-03 Datasheet - Page 2

• Manufacturer Part Number: BAP51-03
• Description: General purpose PIN diode in a SOD323 small plastic SMD package
• Manufacturer: NXP Semiconductors

Specifications of BAP51-03

• Configuration: Single
• Forward Current: 50mA
• Forward Voltage: 1.1V
• Power Dissipation: 500mW
• Operating Temperature Classification: Military
• Reverse Voltage: 50V
• Package Type: SOD-323
• Mounting: Surface Mount
• Maximum Series Resistance @ Minimum If: 9@0.5mAOhm
• Maximum Series Resistance @ Maximum If: 2.5@10mAOhm
• Typical Carrier Life Time: 550ns
• Operating Temperature (max): 150C
• Operating Temperature (min): -65C
• Pin Count: 2
• Lead Free Status / RoHS Status: Compliant

NXP Semiconductors
FEATURES
 Low diode capacitance
 Low diode forward resistance.
APPLICATIONS
 General RF applications.
DESCRIPTION
General purpose PIN diode in a SOD323 small plastic
SMD package.
ORDERING INFORMATION
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
2004 Feb 11
BAP51-03
V
I
P
T
T
F
stg
j
R
tot
General purpose PIN diode
NUMBER
SYMBOL
TYPE
continuous reverse voltage
continuous forward current
total power dissipation
storage temperature
junction temperature
NAME

PARAMETER
plastic surface mounted package; 2 leads
T
S
= 90 C
2
DESCRIPTION
PINNING
PACKAGE
CONDITIONS
Marking code: A5.
The marking bar indicates the cathode.
Fig.1 Simplified outline (SOD323) and symbol.
1
PIN
1
2
2



65
65
cathode
anode
MIN.
Product specification
DESCRIPTION
50
50
500
+150
+150
BAP51-03
MAX.
sym006
VERSION
SOD323
V
mA
mW
C
C
UNIT