AM27C010-90DC Spansion Inc., AM27C010-90DC Datasheet - Page 6
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AM27C010-90DC
Manufacturer Part Number
AM27C010-90DC
Description
Manufacturer
Spansion Inc.
Datasheet
1.AM27C010-90DC.pdf
(12 pages)
Specifications of AM27C010-90DC
Organization
128Kx8
Interface Type
Parallel
In System Programmable
In System/External
Access Time (max)
90ns
Package Type
CDIP
Reprogramming Technique
UV
Operating Supply Voltage (typ)
5V
Operating Supply Voltage (min)
4.5V
Operating Supply Voltage (max)
5.5V
Supply Current
30mA
Pin Count
32
Mounting
Through Hole
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AM27C010-90DC
Manufacturer:
AMD
Quantity:
53
Part Number:
AM27C010-90DC
Manufacturer:
AMD
Quantity:
20 000
CE# should be decoded and used as the primary de-
vice-selecting function, while OE# be made a common
connection to all devices in the array and connected to
the READ line from the system control bus. This as-
sures that all deselected memory devices are in their
low-power standby mode and that the output pins are
only active when data is desired from a particular mem-
ory device.
System Applications
During the switch between active and standby condi-
tions, transient current peaks are produced on the ris-
MODE SELECT TABLE
Notes:
1. V
2. X = Either V
3. A1–A8 and A10–16 = V
4. See DC Programming Characteristics for V
6
Mode
Read
Output Disable
Standby (TTL)
Standby (CMOS)
Program
Program Verify
Program Inhibit
Autoselect
(Note 3)
H
= 12.0 V
Manufacturer Code
Device Code
IH
0.5 V.
or V
IL
.
IL
V
CC
CE#
V
V
V
V
V
V
V
X
IH
IH
IL
IL
IL
IL
IL
0.3 V
PP
voltage during programming.
Am27C010
OE#
V
V
V
V
V
V
X
X
X
IH
IH
IL
IL
IL
IL
ing and falling edges of Chip Enable. The magnitude of
these transient current peaks is dependent on the out-
put capacitance loading of the device. At a minimum, a
0.1 µF ceramic capacitor (high frequency, low inherent
inductance) should be used on each device between
V
to overcome the voltage drop caused by the inductive
effects of the printed circuit board traces on EPROM ar-
rays, a 4.7 µF bulk electrolytic capacitor should be used
between V
tion of the capacitor should be close to where the
power supply is connected to the array.
CC
PGM#
V
V
X
X
X
X
X
X
X
IH
IL
and V
CC
SS
V
A0
V
and V
to minimize transient effects. In addition,
X
X
X
X
X
X
X
IH
IL
SS
for each eight devices. The loca-
A9
V
V
X
X
X
X
X
X
X
H
H
V
V
V
V
X
X
X
X
X
X
PP
PP
PP
PP
Outputs
High Z
High Z
High Z
High Z
D
D
0Eh
01h
D
OUT
OUT
IN