HCPL-4506-560 Avago Technologies US Inc., HCPL-4506-560 Datasheet - Page 8

• Manufacturer Part Number: HCPL-4506-560
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-4506-560

• Number Of Elements: 1
• Input Type: DC
• Forward Voltage: 1.8V
• Forward Current: 25mA
• Output Current: 15mA
• Package Type: PDIP SMD
• Operating Temp Range: -40C to 100C
• Power Dissipation: 145mW
• Propagation Delay Time: 650ns
• Pin Count: 8
• Mounting: Surface Mount
• Reverse Breakdown Voltage: 5V
• Operating Temperature Classification: Industrial
• Output Type: Pull Up
• Isolation Voltage: 3750Vrms
• Current Transfer Ratio: 90%
• Lead Free Status / RoHS Status: Not Compliant

Solder Reflow Temperature Profile
Recommended Pb-Free IR Profile
8
TEMPERATURE
ROOM
T
T
smax
300
200
100
smin
25
T
T
0
p
L
0
NOTE: NON-HALIDE FLUX SHOULD BE USED.
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
NOTE: NON-HALIDE FLUX SHOULD BE USED.
* RECOMMENDED PEAK TEMPERATURE FOR WIDEBODY 400mils PACKAGE IS 245 °C
smax
217 °C
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC.
160 °C
150 °C
140 °C
150 - 200 °C
= 200 °C, T
t 25 °C to PEAK
60 to 180 SEC.
smin
PREHEAT
3 °C/SEC. MAX.
= 150 °C
t
s
50
RAMP-UP
* 260 +0/-5 °C
3 °C + 1 °C/–0.5 °C
150 °C, 90 + 30 SEC.
TIME
PREHEATING TIME
t
2.5 C ± 0.5 °C/SEC.
t
L
p
100
TIME (SECONDS)
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
15 SEC.
60 to 150 SEC.
RAMP-DOWN
6 °C/SEC. MAX.
245 °C
TEMP.
PEAK
150
SEC.
30
SEC.
30
50 SEC.
SOLDERING
200 °C
TIME
200
PEAK
TEMP.
240 °C
TIGHT
TYPICAL
LOOSE
230 °C
TEMP.
PEAK
250