OPL614 Optek Technology (TT electronics), OPL614 Datasheet - Page 4

• Manufacturer Part Number: OPL614
• Manufacturer: Optek Technology (TT electronics)

Specifications of OPL614

• Lead Free Status / RoHS Status: Supplier Unconfirmed

SMD Photologic® Sensor
OPL611 Through OPL615
Issue A
Page 4 of 8
them into the shipping tubes and sealing them in airtight bags. Once removing parts from their shipping
bags, customers are strongly encouraged to solder the devices within four (4) hours. Exposing the parts to
humidity for longer than four (4) hours prior to soldering will require the customer to subject the parts to a 24
hour bake at 100°C prior to use. If the parts will experience future soldering operations, housing the parts
in a dry box or similar environment is encouraged.
times if there are multiple soldering operations and a dry environment cannot be maintained. Once all
soldering operations are completed, exposing the parts to humidity is acceptable.
To combat moisture, Optek bakes all our devices in a 100° C environment for 24 hours prior to inserti ng
12/09
SIDE VIEW
OPTEK reserves the right to make changes at any time in order to improve design and to supply the best product possible.
TOP VIEW
Handling Considerations
SOLDER PROFILE
Phone: [phone] or [phone]
OPL600 Series
(Package Outline)
Pin Function
1
2
3
4
5
6
Note(s):
(see Application Bulletin 237)
Also, it is acceptable to bake the parts multiple
GND
Vout
Dimensions are in millimeters.
If used, connect heat sink pad to GND.
ESD rating is the human body model.
Moisture rating is level 3.
Vcc
NC
NC
NC
OPTEK Technology Inc. — 1645 Wallace Drive, Carrollton, Texas 75006
FAX: [phone] [e-mail] www.optekinc.com
SOLDER PAD LAYOUT