NE960R575-AZ Renesas Electronics America, NE960R575-AZ Datasheet - Page 6

• Manufacturer Part Number: NE960R575-AZ
• Manufacturer: Renesas Electronics America

Specifications of NE960R575-AZ

• Lead Free Status / RoHS Status: Supplier Unconfirmed

RECOMMENDED SOLDERING CONDITIONS
conditions other than those recommended below, contact your nearby sales office.
CHIP HANDLING
DIE ATTACHMENT
attach is not recommended.
BONDING
less in diameter.
within a 280 C_5 minute curve. If longer periods are required, the temperature should be lowered.
PRECAUTIONS
environment.
grounded at all times. In fact, all test and handling equipment should be grounded to minimize the possibilities of
static discharge.
6
Partial Heating
This product should be soldered under the following recommended conditions.
Caution Do not use different soldering methods together (except for partial heating).
Die attach can be accomplished with a Au-Sn (300 10 C) performs in a forming gas environment. Epoxy die
Gate and drain bonding wires should be minimum length, semi-hard gold wire (3 to 8 % elongation) 30 microns or
Bonding should be performed with a wedge tip that has a taper of approximately 15 %.
Die attach and bonding time should be kept to a minimum. As a general rule, the bonding operation should be kept
The user must operate in a clean, dry environment.
The chip channel is glassivated for mechanical protection only and does not preclude the necessity of a clean
The bonding equipment should be periodically checked for sources of surge voltage and should be properly
Soldering Method
Peak temperature (pin temperature)
Soldering time (per pin of device)
Maximum chlorine content of rosin flux (% mass) : 0.2 % (Wt.) or below
Data Sheet PG10026EJ02V0DS
Soldering Conditions
: 350 C or below
: 3 seconds or less
For soldering methods and
NE960R5 SERIES
Condition Symbol
HS350-P3