KIXDP2855TAA Intel, KIXDP2855TAA Datasheet - Page 5

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KIXDP2855TAA

Manufacturer Part Number
KIXDP2855TAA
Description
Manufacturer
Intel
Datasheet

Specifications of KIXDP2855TAA

Lead Free Status / RoHS Status
Supplier Unconfirmed
Complementary Development Tools
Intel
Development Kit (Intel
The Intel
with detailed information regarding system architecture, physical
specifications, and schematics to speed development.
This information is made available to developers at
www.intel.com/go/hdk
Chassis Specifications
Regulatory Testing
and Safety Approval
Physical Dimension
Weight
Power Input
Power Supply Output
Operating Temperature
Storage Temperature
®
Configuration Specifications
Processors
Interfaces
Memory
I/O Option Cards
Memory Module
Internet Exchange Architecture Hardware
®
IXA HDK provides network equipment manufacturers
®
• Single Intel
• Three SPI-3 or UTOPIA-3 ATM/POS for mezzanine/fabric
• Rambus* RDRAM—768 MB at up to 533 MHz/1066 Transfer Rate
• Four QDR SRAM channels:
– one with 16-MB QDR-II SRAM
– two with 8-MB QDR-II SRAM (total of 32 MB for three channels)
– one with a modular QDR-II interface for an optional 16-MB QDR-II SRAM module
(up to 200 MHz/400 Transfer Rate) or a TCAM module (available from third parties)
• Intel
• Intel
• Intel
• Intel
IXA HDK)
@ 1.4 GHz; Intel XScale
®
®
®
®
US FCC/IC DOC Class A, UL/cUL, CE, VCCI, RRL MIC, GOST
436 mm/17.2" x 386 mm/15.2" x 5U
31 lbs. (chassis only) /17 lbs. (external power supply)
Autosensing 100 –240 VAC, 50/60 Hz, 15 Amps max
-48 VDC (25A), 1200W
0° to 40° C (32° to 104° F )
-40° to 70° C (-40° to 158° F )
IXD4OC12T1F Quad OC-3/OC-12 I/O Option Card
IXD1OC48T1F Single OC-48 I/O Option Card
IXD4GETOC Quad Gigabit Ethernet I/O Option Card—Copper
IXQDR2416 16-MB QDR-II SRAM Memory Module
®
IXP2805 or Intel
®
core @ 700 MHz
®
IXP2855 network processor—16 independent RISC microengines
5
Specific content may include:
• a system architecture overview
• component models (IBIS)
• mechanicals and searchable schematics
• board design files (Gerber files)
• signal integrity and thermal analyses
• manufacturing (bill of materials and
• design guides and user manuals
manufacturer information/part numbers)