FI212B245025-T Taiyo Yuden, FI212B245025-T Datasheet - Page 10
![FILTER BANDPASS W-LAN BLUETOOTH](/photos/6/25/62575/fi212c_sml.jpg)
FI212B245025-T
Manufacturer Part Number
FI212B245025-T
Description
FILTER BANDPASS W-LAN BLUETOOTH
Manufacturer
Taiyo Yuden
Series
FIr
Datasheet
1.FI212B245027-T.pdf
(10 pages)
Specifications of FI212B245025-T
Frequency
2.45GHz Center
Bandwidth
100MHz
Filter Type
Bandpass
Ripple
1dB
Insertion Loss
1.4dB
Package / Case
0805 (2012 Metric)
Mounting Type
Surface Mount
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
587-2312-2
chipfil_reli-PRP3
■
■ Please contact of our offices for further details of specifications.
* This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
Precautions
1. PCB Design
2. Soldering
3. Storage conditions
Technical
consider-
Technical
consider-
Technical
consider-
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
All of the standard values listed here are subject to change without notice.
Therefore,please check the specifications carefully before use.
PRECAUTIONS
ations
ations
ations
◆Land pattern design
◆Conditions for Reflow soldering (for reference)
◆Storage
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and hu-
1. If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes
【Reflow Profile】
・ Recommended conditions
・ The packaging material should be kept where no chlorine or sulfur exists in the air.
Land pattern dimension examples
midity in the storage area. Humidity should especially be kept as low as possible.
and deterioration of taping/ packaging materials may take place. For this reason, components should be used within 6 months from the time of delivery. If
exceeding the above period, please check the solderability before using the filter.
The ambient temperature must be kept below 30℃.
Even under ideal storage conditions, the solderbility of electrodes decreases gradually, so filters should be mounted within 6 months from the time of deliv-
ery.
Ambient temperature : ー20~+35℃
Humidity
FI168T/D Type
FI212B Type
FI212P Type
0.50
0.25
: Below 60%RH
Unit : mm
Unit : mm
1.0
FI212B245025/FI212B190223
0.45
0.8
FI168B/L Type
FI105B/L Type
0.3
0.7
0.2
1 1
Unit : mm
Unit : mm
※ Components should be preheated to within
※ Assured to be reflow soldering for 2 times.
Note : The above profiles are the maximum allow-
100 to 130℃ from soldering temperature.
able soldering condition, therefore these
profiles are not always recommended.
FI212C Type
FI212L Type
Unit : mm
Unit : mm
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