FI212L062009-T Taiyo Yuden, FI212L062009-T Datasheet - Page 14

• Manufacturer Part Number: FI212L062009-T
• Description: FILTER LOWPASS DTV ISDB-T SMD
• Manufacturer: Taiyo Yuden
• Series: FIr

Specifications of FI212L062009-T

• Frequency: 638MHz Center
• Bandwidth: 336MHz
• Filter Type: Low Pass
• Ripple: 1.2dB
• Insertion Loss: 1.6dB
• Package / Case: 0805 (2012 Metric)
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 587-2215-2

■ Please contact of our offices for further details of specifications.
1. PCB Design
2. Soldering
3. Storage
△
All of the standard values listed here are subject to change without notice.
Therefore,please check the specifications carefully before use.
！
PRECAUTIONS
conditions
当社カタログをご使用の際には 「当社製品に関するお断り」 を必ずお読みください。
Stages
（Land pattern design）
◆Storage
1. To maintain the solderability of terminal electrodes and to
･ Recommended conditions
･ The packaging material should be kept where no chlorine or
keep the packaging material in good condition, care must
be taken to control temperature and humidity in the storage
area.
Humidity should especially be kept as low as possible.
Ambient temperature
Humidity
The ambient temperature must be kept below 30 ℃.
Even under ideal storage conditions filter electrode soldera-
bitlity decreases as time passes, so filter should be used
within 6 months from the time of delivery.
sulfur exists in the air.
Precautions
ー20∼＋35℃
Below 60％RH
温度 （℃）
300
200
100
0
※チッ プと はんだ温度との差が100∼ １ ３ ０℃以下になるよ
う に十分予熱を行って く だ さ い。
※回数は ２回迄の保証と な り ます。
Land pattern dimension examples
Conditions for Reflow soldering （for reference）
1. If the parts are stocked in a high temperature and humidity environment, problems such
as reduced solderability caused by oxidation of terminal electrodes and deterioration of
taping/ packaging materials may take place. For this reason,components should be
used within 6 months from the time of delivery. If exceeding the above period, please
check solderability before using the filter.
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■
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ピーク260℃以下
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予熱150℃
60秒以上
10秒迄
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Reflow Plofile
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本加熱230℃以上
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40秒迄
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徐冷
Please read the "Notice for TAIYO YUDEN products" before using this catalog.
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Technical considerations
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Temperature （ ℃）
300
200
100
■
0
■
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※Ceramic chip components should be preheated to
※Assured to be reflow soldering for 2 times.
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within 100 to 130℃ of the soldering.
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Peak 260℃ max
10 sec max
60 sec min
Preheating
150℃
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Heating above 230℃
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40 sec max
Gradually
cooling
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