0898LP18A035E Johanson Technology Inc, 0898LP18A035E Datasheet - Page 54

FILTER LOWPASS GSM/CDMA 898MHZ

0898LP18A035E

Manufacturer Part Number
0898LP18A035E
Description
FILTER LOWPASS GSM/CDMA 898MHZ
Manufacturer
Johanson Technology Inc
Datasheets

Specifications of 0898LP18A035E

Frequency
897.5MHz Center
Bandwidth
35MHz
Filter Type
Low Pass
Insertion Loss
0.6dB
Package / Case
1206 (3216 Metric)
Mounting Type
Surface Mount
Frequency Range
880MHz To 915MHz
Return Loss
10.9dB
Bandpass Insertion Loss Max
0.6dB
Attenuation @ Reject Band Min
18dB
Filter Case
1206
Termination Type
SMD
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free by exemption / RoHS Compliant
Ripple
-
Other names
0898LP18A035
712-1120-2
54
C
Metalized substrates may also be patterned to
customer specifications by chemical etching, abrasive
etching, or pattern plating. Please contact the factory
for other types of metallization configurations other than
a continuous top / bottom plating. Other termination
material thicknesses are available upon request.
ALN
Alumina
Titanate Based
Titanate Based
Titanate Based
Titanate Based
Titanate Based
Titanate Based
Titanate Based
Titanate Based
Titanate Based
Titanate Based
Titanate Based
Titanate Based
Titanate Based
Titanate Based
SUBSTRATE
USTOM
MATERIAL
*
*
S
UBSTRATES
MATERIAL
CODE
W
G
C
K
N
U
R
D
B
Y
F
V
L
X
T
Z
& T
12000
1200
2000
2700
4000
8000
120
160
280
350
600
8.8
9.9
23
37
80
K
HIN
www.johansontechnology.com
www.johansontechnology.com
170 W/M deg K (Th. Cond.)
P120 +/- 30 ppm / deg C
0 +/- 30 ppm / deg C
0 +/- 30 ppm / deg C
0 +/- 30 ppm / deg C
-750 +/- 120 ppm / deg C
-1500 +/- 300 ppm / deg C
-750 +/- 120 ppm / deg C
-750 +/- 120 ppm / deg C
+/- 10% (-55 to +125 C)
+/- 10% (-55 to +125 C)
+/- 10% (-55 to +125 C)
+/- 15% (-55 to +125 C)
+/- 15% (-55 to +125 C)
+22/-56% (+10 to +85 C)
+22/-82% (-30 to +85 C)
F
ILM
TEMPERATURE
COEFFICIENT
P
RODUCTS
Johanson Technology offers a wide range
of dielectrics for use in application specific
environments. These materials are available
both lapped and “as fired” condition as well
as metalized and non-metalized substrates.
Standard substrate sizes range from 0.50” x
0.50” to 1.50” x 1.50”, with larger sizes available
with special order . Dielectrics are available from
0.005” to 0.050” thick.
Note: When metallization is requested on
both top and bottom sides, the metallization
will wrap around the sides as a standard
unless otherwise specified.
TiW / Ni / Cu / Ni / Au
METALIZATION
Non-Metallized
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
TaN / TiW / Au
TEMPERATURE
80Au / 20 Sn
TiW / Ni / Au
TiW / Ni / Sn
OPERATING
TiW / Au
< 0.15% @ 1 MHz
< 0.15% @ 1 MHz
< 0.15% @ 1 MHz
< 0.25% @ 1 MHz
< 0.25% @ 1 MHz
< 0.25% @ 1 MHz
< 1.50% @ 1 MHz
< 2.50% @ 1 kHz
< 2.50% @ 1 kHz
< 2.50% @ 1 kHz
< 2.50% @ 1 kHz
< 2.50% @ 1 kHz
< 4.00% @ 1 kHz
< 4.00% @ 1 kHz
DISSIPATION
FACTOR
CODE
N
V
R
C
E
X
T

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