MC100LVEL11DTR2G ON Semiconductor, MC100LVEL11DTR2G Datasheet - Page 4
![no-image](/images/manufacturer_photos/0/4/495/on_semiconductor_sml.jpg)
MC100LVEL11DTR2G
Manufacturer Part Number
MC100LVEL11DTR2G
Description
IC BUFFER FANOUT ECL 1:2 8-TSSOP
Manufacturer
ON Semiconductor
Series
100LVELr
Type
Fanout Buffer (Distribution)r
Datasheet
1.MC100LVEL11DTR2G.pdf
(8 pages)
Specifications of MC100LVEL11DTR2G
Number Of Circuits
1
Ratio - Input:output
1:2
Differential - Input:output
Yes/Yes
Input
ECL, PECL
Output
ECL, PECL
Frequency - Max
1GHz
Voltage - Supply
3 V ~ 3.8 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-TSSOP
Frequency-max
1GHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MC100LVEL11DTR2G
MC100LVEL11DTR2GOSTR
MC100LVEL11DTR2GOSTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC100LVEL11DTR2G
Manufacturer:
XPT
Quantity:
6 890
Part Number:
MC100LVEL11DTR2G
Manufacturer:
ON/安森美
Quantity:
20 000
Table 6. AC CHARACTERISTICS
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
9. V
10. Within-device skew defined as identical transitions on similar paths through a device.
11. Device−to−device skew for identical transitions at identical V
12. Duty cycle skew is the difference between a t
13. V
f
t
t
t
t
V
t
t
Symbol
max
PLH
PHL
SKEW
JITTER
r
f
PP
however, AC delays may move outside of the specified range. The device has a DC gain of ≈40.
PP
EE
(min) is the minimum input swing for which AC parameters guaranteed. The device will function properly with input swings below 200 mV,
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
can vary ±0.3 V.
Maximum Toggle Frequency
Propagation Delay to Output
Within-Device Skew (Note 10)
Device−to−Device (Note 11)
Duty Cycle Skew (Note 12)
Random Clock Jitter (RMS)
Input Swing (Note 13)
Output Rise/Fall Times Q
(20% − 80%)
800
600
400
200
0
0
Characteristic
200
V
CC
400
Figure 2. Output Swing versus Frequency
= 3.3 V; V
PLH
600
and t
EE
= 0.0 V or V
PHL
http://onsemi.com
800
Min
235
200
120
propagation delay through a device.
CC
levels.
−40°C
f (MHz)
CC
Typ
1000
4
10
5
= 0.0 V; V
1000
Max
385
150
320
20
20
1200
EE
= −3.3 V (Note 9)
Min
255
200
120
1400
25°C
Typ
330
220
1.0
0.6
10
5
1600
1000
Max
405
150
320
20
20
1800
Min
285
200
120
2000
85°C
Typ
10
5
1000
Max
435
150
320
20
20
Unit
GHz
mV
ps
ps
ps
ps