MAX9312ECJ+ Maxim Integrated Products, MAX9312ECJ+ Datasheet - Page 2

• Manufacturer Part Number: MAX9312ECJ+
• Description: IC DVR CLK/DATA DUAL 1:5 32LQFP
• Manufacturer: Maxim Integrated Products
• Type: Fanout Buffer (Distribution), Datar

Specifications of MAX9312ECJ+

• Number Of Circuits: 2
• Ratio - Input:output: 1:5
• Differential - Input:output: Yes/Yes
• Input: HSTL, LVECL, LVPECL
• Output: LVECL, LVPECL
• Frequency - Max: 3GHz
• Voltage - Supply: 2.25 V ~ 3.8 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Frequency-max: 3GHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
V
Inputs (CLK_, CLK_) .............................V
CLK_ to CLK_ ....................................................................±3.0V
Continuous Output Current .................................................50mA
Surge Output Current........................................................100mA
V
Continuous Power Dissipation (T
Junction-to-Case Thermal Resistance (T
DC ELECTRICAL CHARACTERISTICS
(V
Dual 1:5 Differential LVPECL/LVECL/HSTL
Clock and Data Drivers
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
PARAMETER
INPUTS (CLK_, CLK _ )
Single-Ended
Input High
Voltage
Single-Ended
Input Low
Voltage
High Voltage of
Differential Input
Low Voltage of
Differential Input
Differential Input
Voltage
Input High
Current
CLK_ Input Low
Current
CC
BB
CC
32-Pin LQFP (derate 20.7mW/°C above +70°C) ....1652.9mW
32-Pin TQFN (derate 34.5mW/°C above +70°C)....2758.6mW
32-Pin LQFP ................................................................12°C/W
32-Pin TQFN ..................................................................2°C/W
_______________________________________________________________________________________
Sink/Source Current ...............................................±0.65mA
- V
- V
EE
EE
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
...............................................................................4.1V
= +2.25V to +3.8V, outputs loaded with 50Ω ±1% to V
SYMBOL
V
I
V
ILCLK
V
V
V
IHD
V
I
IHD
ILD
ILD
IH
IH
IL
-
V
connected
to CLK_
(V
connected
to C LK_)
V
connected
to CLK_
(V
connected
to C LK_)
For V
For V
B B
B B
A
IL
IL
= +70°C)
CONDITIONS
for V
for V
CC
CC
- V
- V
B B
B B
JC
EE
EE
EE
) (Note A)
- 0.3V to V
MAX9312
MAX9314
MAX9312
MAX9314
< 3.0V
≥ 3.0V
CC
+ 0.3V
V
V
V
1.165
0.095
0.095
MIN
1.23
V
V
V
-10
EE
1.2
CC
CC
EE
EE
EE
+
-
-
-40°C
CC
MAX
- 2V.) (Notes 2–5)
V
V
1.475
V
0.095
V
1.62
V
V
V
+10
V
150
Junction-to-Ambient Thermal Resistance (T
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
ESD Protection
Soldering Temperature (10s) ...........................................+300°C
3.0
CC
CC
CC
CC
CC
CC
CC
EE
Human Body Model (CLK_, CLK_, Q_, Q_) ........................2kV
32-Pin LQFP .............................................................48.4°C/W
32-Pin TQFN ................................................................29°C/W
-
-
-
-
V
V
V
1.165
0.095
0.095
MIN
1.23
V
V
V
EE
1.2
-10
CC
CC
EE
EE
EE
+
+25°C
-
-
MAX
V
V
1.475
V
0.095
V
V
V
1.62
V
V
+10
150
3.0
CC
CC
CC
CC
CC
CC
CC
EE
-
-
-
-
V
MIN
V
V
1.165
0.095
0.095
1.23
V
V
V
-10
EE
1.2
CC
CC
EE
EE
EE
+
+85°C
-
-
JA
MAX
V
V
1.475
V
0.095
V
V
V
1.62
V
V
+10
) (Note 1)
150
3.0
CC
CC
CC
CC
CC
CC
CC
EE
-
-
-
-
UNITS
µA
µA
V
V
V
V
V