MC10H641FNG ON Semiconductor, MC10H641FNG Datasheet - Page 9

• Manufacturer Part Number: MC10H641FNG
• Description: IC CLOCK DRV 1:9 PECL-TTL 28PLCC
• Manufacturer: ON Semiconductor
• Type: Fanout Buffer (Distribution)r

Specifications of MC10H641FNG

• Number Of Circuits: 1
• Ratio - Input:output: 1:9
• Differential - Input:output: Yes/Yes
• Input: PECL
• Output: TTL
• Frequency - Max: 65MHz
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 28-PLCC
• Frequency-max: 65MHz
• Logic Type: Latched Translator
• Logic Family: ECL
• Translation: PECL to TTL
• Propagation Delay Time: 6.27 ns
• Supply Voltage (max): 5.25 V
• Supply Voltage (min): 4.75 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: 0 C
• Mounting Style: SMD/SMT
• Logical Function: Latched Translator
• Technology: ECL
• High Level Output Current: -15mA
• Low Level Output Current: 24mA
• Operating Supply Voltage (typ): 5V
• Package Type: PLCC
• Operating Supply Voltage (max): 5.25V
• Operating Supply Voltage (min): 4.75V
• Abs. Propagation Delay Time: 7ns
• Mounting: Surface Mount
• Pin Count: 28
• Operating Temperature (min): 0C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

−L−
C
0.010 (0.250)
28
Z
G1
S
G
T
1
−N−
L−M
NOTES:
S
1. DATUMS −L−, −M−, AND −N− DETERMINED
2. DIMENSION G1, TRUE POSITION TO BE
3. DIMENSIONS R AND U DO NOT INCLUDE
4. DIMENSIONING AND TOLERANCING PER
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
7. DIMENSION H DOES NOT INCLUDE DAMBAR
V
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
MEASURED AT DATUM −T−, SEATING PLANE.
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
ANSI Y14.5M, 1982.
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
N
A
R
S
J
E
−M−
W
VIEW S
0.007 (0.180)
Y BRK
0.007 (0.180)
D
D
PACKAGE DIMENSIONS
PLASTIC PLCC PACKAGE
−T−
0.004 (0.100)
http://onsemi.com
SEATING
PLANE
CASE 776−02
M
M
FN SUFFIX
PLCC−28
ISSUE E
T
T
L−M
L−M
9
S
S
B
Z
N
N
DIM
G1
K1
W
A
B
C
G
H
K
R
U
E
F
J
V
X
Y
Z
S
VIEW D−D
S
U
X
0.485
0.485
0.165
0.090
0.013
0.026
0.020
0.025
0.450
0.450
0.042
0.042
0.042
0.410
0.040
0.007 (0.180)
MIN
−−−
K
0.050 BSC
2
INCHES
_
0.007 (0.180)
0.495
0.495
0.180
0.019
0.032
0.456
0.456
0.048
0.048
0.056
0.020
0.430
0.110
MAX
VIEW S
−−−
−−−
10
−−−
_
H
12.32
12.32
10.42
M
11.43
11.43
MILLIMETERS
MIN
4.20
2.29
0.33
0.66
0.51
0.64
1.07
1.07
1.07
1.02
−−−
1.27 BSC
2
G1
_
T
F
M
L−M
12.57
12.57
11.58
11.58
10.92
MAX
4.57
2.79
0.48
0.81
1.21
1.21
1.42
0.50
−−−
−−−
10
−−−
0.007 (0.180)
T
K1
_
0.010 (0.250)
S
0.007 (0.180)
L−M
N
S
S
N
M
S
S
M
T
T
T
L−M
L−M
L−M
S
S
S
N
N
N
S
S
S