MC100EP140DG ON Semiconductor, MC100EP140DG Datasheet - Page 6

• Manufacturer Part Number: MC100EP140DG
• Description: IC DETECT PH FREQ 3.3V ECL 8SOIC
• Manufacturer: ON Semiconductor
• Series: 100EPr
• Type: Phase Frequency Detectorr

Specifications of MC100EP140DG

• Pll: No
• Input: CML, NECL, PECL
• Output: ECL
• Number Of Circuits: 1
• Ratio - Input:output: 1:2
• Differential - Input:output: No/Yes
• Frequency - Max: 2GHz
• Divider/multiplier: No/No
• Voltage - Supply: ±3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Frequency-max: 2GHz
• Function: Frequency Detector
• Operating Temperature (max): 85C
• Operating Temperature (min): -40C
• Package Type: SOIC N
• Pin Count: 8
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: MC100EP140DGOS

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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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−Z−
−Y−
B
H
−X−
8
1
0.25 (0.010)
G
A
D
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
4
5
M
Z
S
Y
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
S
C
0.25 (0.010)
X
SEATING
PLANE
S
0.024
0.10 (0.004)
0.6
0.275
M
7.0
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
Y
http://onsemi.com
M
N
CASE 751−07
X 45
SOIC−8 NB
ISSUE AH
_
M
6
K
SCALE 6:1
0.060
0.155
1.52
4.0
1.270
0.050
J
inches
mm
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE DAMBAR
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
STANDARD IS 751−07.
DIM
M
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
A
B
C
D
G
H
K
N
S
J
MILLIMETERS
MIN
4.80
3.80
1.35
0.33
0.10
0.19
0.40
0.25
5.80
0
1.27 BSC
_
MAX
5.00
4.00
1.75
0.51
0.25
0.25
1.27
0.50
6.20
8
_
0.189
0.150
0.053
0.013
0.004
0.007
0.016
0.010
0.228
MIN
MC100EP140/D
0
0.050 BSC
INCHES
_
0.197
0.157
0.069
0.020
0.010
0.010
0.050
0.020
0.244
MAX
8
_