LMC555CM/NOPB National Semiconductor, LMC555CM/NOPB Datasheet
LMC555CM/NOPB
Specifications of LMC555CM/NOPB
*LMC555CM/NOPB
LMC555CM
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LMC555CM/NOPB Summary of contents
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... Molded Dip (MDIP) 8-Bump micro SMD NOPB Note: See Mil-datasheet MNLMC555-X for specifications on the military device LMC555J/883. LMCMOS™ trademark of National Semiconductor Corp. © 2010 National Semiconductor Corporation LMC555 Features ■ Less than 1 mW typical power dissipation at 5V supply ■ ...
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Connection Diagrams www.national.com 8-Pin SOIC, MSOP, MDIP Top View 8-Bump micro SMD Top View (Bump Side Down) 2 866901 866909 ...
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... Absolute Maximum Ratings 3) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage Input Voltages TRIG RES CTRL V THRESH Output Voltages DIS Output Current DIS Storage Temperature Range Soldering specification for MDIP package: ...
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Symbol Parameter f Astable Frequency A f Maximum Frequency MAX Output Rise and R F Fall Times t Trigger Propagation Delay PD Note 1: All voltages are measured with respect to the ground pin, unless otherwise specified. ...
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Application Information MONOSTABLE OPERATION In this mode of operation, the timer functions as a one-shot (Figure 1). The external capacitor is initially held discharged by internal circuitry. Upon application of a negative trigger pulse of less than 1 ...
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Figure 5 shows the waveform generated in this mode of op- eration Top Trace: Output 5 V/Div. CC TIME = 20 µs/Div. Bottom Trace: Capacitor Voltage 1 V/Div 3.9 kΩ kΩ ...
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Top Trace: Modulation 1 V/Div. CC TIME = 0.2 ms/Div. Bottom Trace: Output Voltage 2 V/Div 9.1 kΩ 0.01 µF FIGURE 9. Pulse Width Modulator Waveforms PULSE POSITION MODULATOR This application uses ...
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Physical Dimensions 8-Pin (0.118” Wide) Molded Mini Small Outline Package www.national.com inches (millimeters) unless otherwise noted Molded Small Outline (SO) Package (M) NS Package Number M08A NS Package Number MUA08A 8 ...
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Molded Dual-in-line Package (N) NS Package Number N08E 9 www.national.com ...
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... NOTES: UNLESS OTHERWISE SPECIFIED 1. EPOXY COATING 2. FOR SOLDER BUMP COMPOSITION, SEE “SOLDER INFORMATION” IN THE PACKAGING SECTION OF THE NATIONAL SEMICONDUCTOR WEB PAGE (www.national.com). 3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD. 4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. 5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH PACKAGE LENGTH AND X3 IS PACK- AGE HEIGHT ...
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Notes 11 www.national.com ...
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