179610-1 TE Connectivity, 179610-1 Datasheet - Page 7

• Manufacturer Part Number: 179610-1
• Description: AMP CT CRIMP-2 REC CONT. L/P
• Manufacturer: TE Connectivity

Specifications of 179610-1

• Product Type: Contact
• Termination Method To Wire/cable: Crimp
• Contact - Rated Current (a): 2
• Operating Voltage Reference: AC/DC, AC, DC
• Operating Voltage (vac): 125
• Operating Voltage (vdc): 125
• Wire/cable Size (awg): 26 – 30
• Mating Retention: Without
• Contact Type: Socket
• Contact Plating, Mating Area, Material: Pre-Tin
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Not relevant for lead free process
• Rohs/elv Compliance History: Always was RoHS compliant
• Operating Temperature (°c [°f]): -30 – +105 [-22 – +221]
• Applies To: Wire/Cable
• Accepts Wire Insulation Diameter, Range (mm [in]): 0.65 – 1.35 [0.0255 – 0.053]
• Application Use: Wire-to-Board, Wire-to-Board / Wire-to-Wire, Wire-to-Wire
• Contact Transmits (typical Application): Signal (Data)
• Packaging Method: Loose Piece

ASHL-0005- ES REV B
3.8.3 (10)
3.8.3 (11)
3.8.3 (8)
3.8.3 (9)
(11-1)
(11-2)
Para.
3.8.3
3.8.3
Sulfurous Acid
Gas
Solderability
Resistance to
Soldering Heat
Sequence
Testing
Connector
Repeated
Mating
/Unmating
Temperature
Humidity
Cycling
Test Items
AMP Shanghai Ltd.
Tyco Electronics
Termination resistance (low level) shall be
met.
Solderable area shall have a solder coverage
of 90% Min.
No physical damage shall be evident after
testing.
The requirements for the each testing level
shall be met.
After testing, termination resistance (low
level) shall be met.
After testing, termination resistance (low
level) shall be met.
Requirements
Fig. 2 (End)
7 of 11
PAGE
Document No.
108-5408
Subject mated connectors to
sulfurous acid gas atmosphere
of 3±1ppm concentration at
40±2
Subsequent measurement shall
be done after reconditioning in
the room temperature for 1
hour.
Subject contacts to solderability
testing, as specified.
MIL-STD-202, Method 208.
Subject product mounted on
printed circuit boards to solder
bath at 260±5
seconds
MIL-STD-202, Method 210
except as indicated above when
testing by manual soldering
iron, apply it as 350±10
1~2 seconds without forcing
pressure to affect the tine of
contact.
SMT product mounted on
printed circuit boards to solder
reflow as like Fig. 7.
See Para. 3.8.3 (11-1) and
Para. 3.8.3 (11-2)
Subject connector assembly to
30 cycles of repeated
mating/unmating at a rate of 10
cycles a minute.
Subject mated connector to
temperature changes between
25
JIS C 5024.
for 5 cycles.
o
C and 65
o
C for 240 hours.
Procedures
o
C with 95 % R.H.
o
C for 10±1
REV
B
o
C for
LOC
ES