3-1674770-2 TE Connectivity, 3-1674770-2 Datasheet
3-1674770-2
Manufacturer Part Number
3-1674770-2
Description
EMBOSS ASSY PITCH 56MM MPGA478
Manufacturer
TE Connectivity
Specifications of 3-1674770-2
Insertion Force
ZIF
Pcb Mount Style
Surface Mount
Grid Size
26x26
Grid Spacing (mm [in])
1.27 x 1.27 [.050 x .050]
Chip Compatibility
Intel® Pentium® M MOBILE (mPGA478C pattern)
Frame Style
Open
Heat Sink Attachment
Without
Zif Actuator
Screwdriver/Cam
Profile
Low
Cover Material
High Temperature Thermoplastic
Leg Style
Ball Grid Array (BGA)
Socket Identifier
mPGA478C
Socket Overall Height (mm [in])
3 [0.118]
Number Of Positions
478
Assembly Process Feature
Pick and Place Cover, Tape
Cover Color
Black
Contact Style
Stamped + Formed
Contact Base Material
Copper Alloy
Contact Plating, Mating Area, Material
Gold (30)
Housing Color
Black
Housing Material
High Temperature Thermoplastic
Ul Flammability Rating
UL 94V-0
Housing Material Temperature
High
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Reflow solder capable to 245°C
Rohs/elv Compliance History
Always was RoHS compliant
Application
Production
Packaging Method
Tape Mounted on Reel
Packaging Quantity
160 sockets/box
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