50462-8 TE Connectivity, 50462-8 Datasheet

50462-8

Manufacturer Part Number

50462-8

Description

Spring Contact

Manufacturer

TE Connectivity

Datasheet

1.50462-6.pdf (1 pages)

Specifications of 50462-8

Peak Reflow Compatible (260 C)

Body Material

Copper

Leaded Process Compatible

Features

Closed Flat Bottom

Overall Length

0.178"

Body Plating

Tin

Rohs Compliant

Socket Length (mm [in])

4.52 [0.178]

Sleeve Style

Closed Bottom

Sealant

Without

Sleeve Material

Copper

Recommended Hole Size (mm [in])

1.32 [0.052]

Mating Pin Dia. Range (mm [in])

0.36 – 0.66 [0.014 – 0.026]

Sleeve Material Plating

Tin

Spring Material

Beryllium Copper

Contact Spring Plating

Gold (30)

Contact Base Material

Beryllium Copper

Insertion Method

Hand/Semi-Automatic

Government/industry Qualification

Rohs/elv Compliance

Not ELV/RoHS compliant

Lead Free Solder Processes

Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C, Reflow solder capable to 245°C, Reflow solder capable to 260°C, Pin-in-Paste capable to 245°C, Pin-in-Paste capable to 260°C

Application

Production

Packaging Method

Loose Piece

For Use With

0.014 To 0.026 In. Maitng Pin Diameter

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