MCP4531T-503E/MF Microchip Technology, MCP4531T-503E/MF Datasheet - Page 3
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MCP4531T-503E/MF
Manufacturer Part Number
MCP4531T-503E/MF
Description
IC DGTL POT 50K 128TAPS 8-DFN
Manufacturer
Microchip Technology
Datasheet
1.MCP4531-104EMS.pdf
(88 pages)
Specifications of MCP4531T-503E/MF
Package / Case
8-DFN
Taps
129
Resistance (ohms)
50K
Number Of Circuits
1
Temperature Coefficient
150 ppm/°C Typical
Memory Type
Volatile
Interface
I²C, 2-Wire Serial
Voltage - Supply
1.8 V ~ 5.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Resistance In Ohms
50K
Number Of Pots
Single
Taps Per Pot
128
Resistance
50 KOhms
Wiper Memory
Volatile
Digital Interface
Serial (2-Wire, I2C)
Operating Supply Voltage
2.5 V, 3.3 V, 5 V
Supply Current
2.5 uA
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.8 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
MCP4531T-503E/MFTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCP4531T-503E/MF
Manufacturer:
Microchip
Quantity:
3 167
1.0
Absolute Maximum Ratings †
Voltage on V
Voltage
to V
Voltage on all other pins (PxA, PxW, and PxB)
with respect to V
Input clamp current, I
(V
Output clamp current, I
(V
Maximum output current sunk by any Output pin
Maximum output current sourced by any Output pin
Maximum current out of V
Maximum current into V
Maximum current into P
Storage temperature ....................................-65°C to +150°C
Ambient temperature with power applied
Total power dissipation (Note 1) ................................400 mW
Soldering temperature of leads (10 seconds) ............. +300°C
ESD protection on all pins .................................. ≥ 4 kV (HBM),
Maximum Junction Temperature (T
© 2008 Microchip Technology Inc.
......................................................................................25 mA
......................................................................................25 mA
.......................................................................... ≥ 300V (MM)
I
O
Note 1: Power dissipation is calculated as follows:
< 0, V
SS .............................................................................
< 0 or V
on HVC/A0, A1, A2, SCL, and SDA
I
ELECTRICAL
CHARACTERISTICS
> V
O
DD
DD
> V
with respect to V
, V
SS .........................................
DD
I
) ..................................................±20 mA
> V
P
IK
DIS
OK
PP ON
DD
X
A, P
SS
= V
pin ....................................100 mA
pin .................................100 mA
X
DD
HV pins) ......................±20 mA
W & P
SS
x {I
J
............... -0.6V to +7.0V
) ......................... +150°C
X
DD
B pins ............±2.5 mA
- ∑ I
-0.3V to V
-40°C to +125°C
OH
-0.6V to 12.5V
} + ∑ {(V
with respect
DD
+ 0.3V
MCP453X/455X/463X/465X
DD
-V
OH
) x I
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
OH
} + ∑(V
OL
x I
OL
)
DS22096A-page 3