MCP4131-503E/SN Microchip Technology, MCP4131-503E/SN Datasheet - Page 74
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
MCP4131-503E/SN
Manufacturer Part Number
MCP4131-503E/SN
Description
IC POT DGTL SNGL 50K SPI 8SOIC
Manufacturer
Microchip Technology
Specifications of MCP4131-503E/SN
Package / Case
8-SOIC (3.9mm Width)
Taps
129
Resistance (ohms)
50K
Number Of Circuits
1
Temperature Coefficient
150 ppm/°C Typical
Memory Type
Volatile
Interface
SPI Serial
Voltage - Supply
1.8 V ~ 5.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Resistance In Ohms
50K
Number Of Pots
Single
Taps Per Pot
128
Resistance
50 KOhms
Wiper Memory
Volatile
Digital Interface
Serial (SPI)
Operating Supply Voltage
2.5 V, 3.3 V, 5 V
Supply Current
1 mA
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.8 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCP4131-503E/SN
Manufacturer:
Microchip
Quantity:
321
Part Number:
MCP4131-503E/SN
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
MCP413X/415X/423X/425X
DS22060A-page 74
14-Lead Plastic Small Outline (SL) – Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A1
1
N
2
b
3
D
Dimension Limits
e
Units
A1
E1
A2
L1
E1
N
A
E
D
α
e
h
L
φ
c
b
β
A2
E
1.25
0.10
0.25
0.40
0.17
0.31
MIN
φ
0°
5°
5°
–
L
MILLIMETERS
h
1.27 BSC
6.00 BSC
3.90 BSC
8.65 BSC
1.04 REF
L1
NOM
14
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-065B
h
© 2007 Microchip Technology Inc.
MAX
β
1.75
0.25
0.50
1.27
0.25
0.51
15°
15°
8°
–
α
c